AVS 59th Annual International Symposium and Exhibition
    Plasma Science and Technology Thursday Sessions
       Session PS-ThP

Paper PS-ThP39
Increase Film Quality and Campaign Length in Reactive Sputtering Applications With Pulsed-DC Power

Thursday, November 1, 2012, 6:00 pm, Room Central Hall

Session: Plasma Science and Technology Poster Session
Presenter: D. Pelleymounter, Advanced Energy Industries Inc.
Correspondent: Click to Email
In reactive sputtering applications, arcs can contribute to costly film defects and process interruptions. Charge buildups on small areas of the target cause these electrical breakdowns, or arcs, which manifest as particles on the substrate—leading to defects, pinholes, rate reduction, short circuits, or other undesirable process disturbances and loss of film quality. Entire lots are oftentimes scrapped due to poor quality thin film layers, and severe arcing can damage equipment and shut down entire lines for maintenance. While there are several types of process power technologies available to help manage arcs, pulsed-DC technology offers a marked performance advantage over AC or straight DC power. The addition of low frequency pulsing lowers the effective electronic voltage of the whole plasma while maintaining the actual delivered voltage of individual electrons for high deposition rate and film flatness. Improved packing density also results. Adding reverse voltage while pulsing momentarily stops the energized electrons in the plasma and creates a haphazard path to the substrate, preventing hills and valleys from forming. This paper discusses how pulsed DC power conversion technologies can do much more than supply power but effectively manage arcs for greater surface control, film quality, and overall process control.