AVS 59th Annual International Symposium and Exhibition
    Applied Surface Science Tuesday Sessions
       Session AS-TuP

Paper AS-TuP6
XPS Depth Analysis of Metal/Polymer Multilayer by Electrospray Droplet Impact

Tuesday, October 30, 2012, 6:00 pm, Room Central Hall

Session: Applied Surface Science Poster Session
Presenter: Y. Sakai, University of Yamanashi, Japan
Authors: Y. Sakai, University of Yamanashi, Japan
R. Takaishi, University of Yamanashi, Japan
S. Ninomiya, University of Yamanashi, Japan
K. Hiraoka, University of Yamanashi, Japan
Correspondent: Click to Email
The electrospray droplet impact (EDI) has been developed for cluster SIMS [1]. EDI utilizes the charged water droplets as projectiles for reducing the sample surface degradations often encountered in atomic-ion SIMS. EDI projectiles are extremely large water cluster ions generated by an ambient electrospray (masses of several 106 u). EDI is capable of atomic- and molecular-level etching with little damage after the irradiation. The EDI gun has been installed in X-ray Photoelectron Spectroscopy (XPS) instrument to analyze the dynamic etching processes during the EDI irradiation. This system has been applied to various organic and inorganic materials. A comparative study of Ar+ and EDI etching was performed. While selective etching was observed for almost all of the samples examined by Ar+, no chemical modification was recognized by EDI [2,3]. The multilayer metal/polymer samples are used for many practical applications such as transducer, optical device and packaging, etc. For example, the metal layers in integrated circuits are used as the electrical connection and barrier. The interface analysis of metal/ polymer multilayer is of significant importance to clarify the diffusion phenomena taking place between metal and polymer interface. Thus, the ion gun for the interface analysis that is capable of molecular-level etching with no chemical modification is highly demanded. Our preliminary experimental data showed that the EDI gun is very useful for metal/polymer interface analysis. In this report, the depth analysis of Cu/Polymer/Si by EDI etching will be presented.Reference[1] K. Hiraoka, D. Asakawa, S. Fujimaki, A. Takamizawa, K. Mori, Eur. Phys. J. D 38, 225 (2006)[2] Y. Sakai, Y. Iijima, D. Asakawa and K. Hiraoka, Surf. Interface Anal. 42, 658 (2010)[3] Y. Sakai, S. Ninomiya and K. Hiraoka, Surf. Interface Anal. 43,1605 ( 2011)