AVS 58th Annual International Symposium and Exhibition
    Plasma Science and Technology Division Thursday Sessions

Session PS-ThM
Neutral Beam and Low Damage Processing

Thursday, November 3, 2011, 8:00 am, Room 201
Moderator: Sophie Bouchoule, CNRS-LPN


  Click here to Download program book for this session  
  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

8:00am PS-ThM1 Invited Paper
2010 Plasma Prize Lecture - Super-low Damage Top-down Processing for Future Nanoscale Devices
Seiji Samukawa, Tohoku University, Japan
8:40am PS-ThM3
A Numerical Simulation Method for Plasma-induced Damage Profile in SiO2 Etching
Nobuyuki Kuboi, T. Tatsumi, S. Kobayashi, J. Komachi, M. Fukasawa, T. Kinoshita, H. Ansai, Sony Corporation, Japan
9:00am PS-ThM4
Theoretical Analysis of Electron Transfer during the Process of Neutral Beam Generation
Naoki Watanabe, S. Ohtsuka, T. Iwasaki, K. Ono, Y. Iriye, Mizuho Information & Research Institute, Inc., Japan, S. Ueki, BEANS Project 3D BEANS Center, Japan, O. Nukaga, Fujikura Ltd.,Japan, T. Kubota, Tohoku University, Japan, M. Sugiyama, University of Tokyo, Japan, S. Samukawa, Tohoku University, Japan
9:20am PS-ThM5
Energy and Angular Distribution Analysis for Neutral Beam and Application for Etching Simulation
Shingo Ohtsuka, N. Watanabe, T. Iwasaki, K. Ono, Mizuho Information & Research Institute, Inc., Japan, Y. Iriye, O. Nukaga, S. Ueki, BEANS Project 3D BEANS Center, Japan, T. Kubota, Tohoku University, Japan, M. Sugiyama, University of Tokyo, Japan, S. Samukawa, Tohoku University, Japan
9:40am PS-ThM6
High-Aspect-Ratio Silicon Etching using Large-Diameter Neutral Beam Source
Tomohiro Kubota, Tohoku University and BEANS Project, Japan, A. Wada, Tohoku University, Japan, S. Ohtsuka, K. Ono, Mizuho Information & Research Institute, Inc., Japan, H. Ohtake, Tohoku University, Japan, S. Ueki, Y. Nishimori, BEANS Project, Japan, G. Hashiguchi, Shizuoka University and BEANS Project, Japan, S. Samukawa, Tohoku University, Japan
10:40am PS-ThM9
Improvement in the Evaluation Technique for Plasma-Etch Si Damage using Photoreflectance Spectroscopy with Temperature Control
Asahiko Matsuda, Y. Nakakubo, Y. Takao, K. Eriguchi, K. Ono, Kyoto University, Japan
11:00am PS-ThM10
The Mechanism of Thin SiO2 and GeO2 Film Formation during Low-Temperature Neutral Beam Oxidation Process
Akira Wada, Tohoku University, Japan, K. Endo, M. Masahara, AIST, Japan, S. Samukawa, Tohoku University, Japan
11:20am PS-ThM11
Room Temperature Radical Annealing of Plasma Damaged Gallium Nitride
Shang Chen, Y. Lu, K. Takeda, K. Ishikawa, H. Kondo, Nagoya University, Japan, H. Kano, NU Eco-engineering Co., Ltd, Japan, H. Amano, Nagoya University, Japan, Y. Tokuda, Aichi Insititute of Technology, Japan, T. Egawa, Nagoya Institute of Technology, Japan, M. Sekine, M. Hori, Nagoya University, Japan
11:40am PS-ThM12
Effect of Rapid Thermal Annealing on Si Surface Damage by HBr/O2- and H2-Plasma
Yoshinori Nakakubo, A. Matsuda, Kyoto University, Japan, M. Fukasawa, Sony Corporation, Japan, Y. Takao, Kyoto University, Japan, T. Tatsumi, Sony Corporation, Japan, K. Eriguchi, K. Ono, Kyoto University, Japan