| AVS 58th Annual International Symposium and Exhibition | |
| Plasma Science and Technology Division | Wednesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 2:00pm | PS+EM-WeA1 Invited Paper Electric and Optical Characterization of Leakage and Breakdown in Low-k Dielectric Materials J.M. Atkin, R. Laibowitz, Columbia University, T.M. Shaw, IBM T.J. Watson Research Center, Tony Heinz, Columbia University |
| 2:40pm | PS+EM-WeA3 Electron Spin Resonance Study of Low-K Dielectrics and Etch Stop Layers Brad Bittel, P.M. Lenahan, T.A. Pomorski, Penn State University, S. King, Intel Corporation |
| 4:00pm | PS+EM-WeA7 The Nature of Defects in Low-k Organosilicate Glass and their Response to Plasma Exposure He Ren, M.T. Nichols, University of Wisconsin-Madison, G. Jiang, G.A. Antonelli, Novellus Systems, Y. Nishi, Stanford University, J.L. Shohet, University of Wisconsin-Madison |
| 4:20pm | PS+EM-WeA8 The Effects of Plasma Exposure on the Time Dependent Dielectric Breakdown of Low-k Porous Organosilicate Glass Michael Nichols, H. Sinha, University of Wisconsin-Madison, G.A. Antonelli, Novellus Systems, Inc., Y. Nishi, Stanford University, J.L. Shohet, University of Wisconsin-Madison |
| 4:40pm | PS+EM-WeA9 Modeling the Penetration of Vacuum Ultraviolet Photons in Porous-ULK Films Joe Lee, D.B. Graves, University of California, Berkeley |
| 5:00pm | PS+EM-WeA10 Characterization of Plasma-Induced Damages on Low-k during Interconnection Integration by Scatterometric Porosimetry Romain Hurand, STMicroelectronics, France, M. Darnon, T. Chevolleau, D. Fuard, CNRS-LTM, France, F. Bailly, R. Bouyssou, STMicroelectronics, France, T. David, CEA Leti, France, O. Joubert, CNRS-LTM, France, F. Leverd, STMicroelectronics, France |
| 5:20pm | PS+EM-WeA11 Photon Effects in Damage of Porous Low-k SiOCH During Plasma Cleaning Juline Shoeb, Iowa State University, M.J. Kushner, University of Michigan |
| 5:40pm | PS+EM-WeA12 X-ray Photoelectron Spectroscopy Investigation of the Schottky Barrier at BN/Cu Interfaces Marc French, M. Jaehnig, M. Kuhn, J. Bielefeld, S. King, B. French, Intel Corporation |