AVS 57th International Symposium & Exhibition
    Plasma Science and Technology Tuesday Sessions
       Session PS-TuP

Paper PS-TuP16
Numerical Simulations of a Magnetron Plasma Sputtering System using VORPAL

Tuesday, October 19, 2010, 6:00 pm, Room Southwest Exhibit Hall

Session: Plasma Science and Technology Poster Session
Presenter: C.M. Roark, Tech-X Corporation
Authors: C.M. Roark, Tech-X Corporation
C. Zhou, Tech-X Corporation
P.H. Stoltz, Tech-X Corporation
Correspondent: Click to Email
Three-dimensional numerical simulations are conducted for a magnetron sputtering plasma and target using the particle-in-cell code VORPAL. These simulations require accurate models of particle dynamics, Monte Carlo collisions and self-consistent electric and magnetic fields. The sputtering yield is calculated for materials commonly used in industrial applications. Sputter patterns are compared with experimental measurements, and in particular, we discuss non-uniformities in the sputter patterns and compare with the cross-corner effect. We also discuss the role of charge exchange and elastic scattering on the sputter patterns.