| 2:00pm |
MS-ThA1 Invited Paper
Three-dimensional Imaging of Nano-Voids in Copper Interconnects using Incoherent Bright Field Tomography
P. Ercius, M. Weyland, D.A. Muller, Cornell University, L.M. Gignac, Thomas J. Watson Research Center |
| 2:40pm |
MS-ThA3
Critical Dimension Metrology: A Comprehensive Evaluation of Current Techniques in Spectroscopy-Based Scatterometry
C. Saravanan, Z. Liu, Nanometrics Inc |
| 3:00pm |
MS-ThA4
Low Coherence Optical Intereferometry and Raman Scattering Spectroscopy for Stress Tensor Measurements
W.J. Walecki, T. Azfar, A. Pravdivtsev, A. Koo, J. Ryu, Frontier Semiconductor |
| 3:20pm |
MS-ThA5
Micro-Probe CV and IV Analysis of Thin Dielectric Films in Product Wafer Scribe-Line Structures
V.V. Souchkov, T.M.H. Wong, V.N. Faifer, M.I. Current, Frontier Semiconductor |
| 3:40pm |
MS-ThA6
Characterizing Copper Lines for Advanced Interconnect Using Normal Incidence Scatterometry
Z. Liu, Y. Hao, Nanometrics Inc. |
| 4:00pm |
MS-ThA7
Leakage Current and Dopant Activation in Ultra-Shallow Junctions Following Ms-Anneals Measured by Non-Contact Junction Photo-Voltage Methods
V.N. Faifer, T.M.H. Wong, M.I. Current, Frontier Semiconductor |