AVS 53rd International Symposium
    Plasma Science and Technology Tuesday Sessions
       Session PS3-TuP

Paper PS3-TuP12
Properties of Various Polyparylenes Deposited by Conventional and Plasma-Enhanced Chemical Vapour Deposition

Tuesday, November 14, 2006, 6:00 pm, Room 3rd Floor Lobby

Session: Advanced Plasma Deposition Poster Session
Presenter: G. Franz, Munich University of Applied Sciences, Germany
Authors: G. Franz, Munich University of Applied Sciences, Germany
S.F. Dribinskiy, Munich University of Applied Sciences, Germany
D. Voss, Plasma-Parylene Coating Services, Germany
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Polyparylene, a non-critical, non-toxic layer material for long-term applications in the human body but also a very promising candidate for a low-@kappa@ dielectric, has been deposited by conventional and plasma-enhanced chemical vapor deposition of the monomeric species (types C and N), and partly with CF@sub 4@. For that end, a microwave discharge in a pulsed mode has been applied. The characterization of the layer parameters has been compared with conventionally prepared cvd data. The analytical tools were scanning electron microscopy and atomic force microscopy to determine the surface roughness and density of voids in the film; the surface tension has been evaluated by contact angle measurements and the high-frequency dielectric constant by ellipsometry. Fourier-transform infrared spectroscopy served to define the occurrence of functional groups. The most prominent detail is the contact angle against water and the organic solvent CH@sub 2@I@sub 2@ which varies between very flat angles up to nearly 180° so it is possible to fabricate plasma-generated films which simultaneously exhibit hydrophobic and lipophobic character. Conventionally produced films, however, are more or less hydrophobic. Together with the very smooth surface which nearly completely lacks voids, we refer this conduct partly by physical reasons: the higher energy of the layer-composing molecules in the plasma case. In a chemical sense, this behavior is caused by the almost complete destruction of the benzene ring even in a relatively gentle plasma. Eventually, the tribological and dielectric film properties are correlated with the deposition conditions.