AVS 52nd International Symposium | |
Thin Films | Wednesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
8:20am | TF-WeM1 Invited Paper Mechanical Properties of Thin Films and Multilayers F. Spaepen, Harvard University |
9:00am | TF-WeM3 Evaluation of Applied Substrate Bias on Yttria-Stabilized Zirconia Thin Films J.R. Piascik, University of North Carolina at Chapel Hill and RTI International, J.Y. Thompson, University of North Carolina at Chapel Hill, C.A. Bower, RTI International, B.R. Stoner, RTI International and University of North Carolina at Chapel Hill |
9:20am | TF-WeM4 Ion Beam Assisted Deposition of Cubic Zirconia X. Wang, University of Nebraska-Lincoln, I. Amirani, S. Varma, University of Nebraska Medical Center, D.W. Thompson, University of Nebraska-Lincoln, F. Namavar, Universoty of Nebraska Medical Center, N.J. Ianno, University of Nebraska-Lincoln |
9:40am | TF-WeM5 Effects of TiO@sub x@ PVD Deposition Parameters on the Preferred Orientation and Adhesion of Pt Films on @gamma@-Al@sub 2@O@sub 3@ E. Derniaux, P. Kayser, C. Gageant, C. Sanchez, D. Boivin, ONERA France |
10:00am | TF-WeM6 Microstructure and Stress of Room Temperature Reactively Sputtered RuOx Thin Films J. Shi, T.M. Klein, The University of Alabama |
10:20am | TF-WeM7 Synthesis of Carbon Films with Ultralow Friction in Dry and Humid Air C.A. Freyman, Y.F. Chen, B. Zhao, Y.W. Chung, Northwestern University |
10:40am | TF-WeM8 Surface Modification of Si@sub 3@N@sub 4@ Probes for Adhesion and Wear Reduction Z. Tao, B. Bhushan, The Ohio State University |
11:00am | TF-WeM9 Ultra-Hard Al-Si Nanocomposites Synthesized by High-rate Co-evaporation D. Mitlin, C. Ophus, University of Alberta, Canada, V. Radmilovic, T.J. Richardson, U. Dahmen, Lawrence Berkeley National Laboratory |
11:20am | TF-WeM10 Hard Coatings of Tungsten Nitride Grown by Reactive Sputtering and Laser Ablation E.C. Samano, A. Clemente, M.J. Oviedo, G. Soto, CCMC-UNAM, Mexico |
11:40am | TF-WeM11 Electron Spectroscopic Studies of Friction Modifier Thin Films K.C. Wong, University of British Columbia, Canada, X. Lu, Kelsan Technologies Corp., P.C. Wong, University of British Columbia, Canada, J. Cotter, D. Eadie, Kelsan Technologies Corp., K.A.R. Mitchell, University of British Columbia, Canada |