AVS 52nd International Symposium
    Plasma Science and Technology Tuesday Sessions
       Session PS-TuP

Paper PS-TuP4
Linearized Process Model Analysis As a Means of Understanding the Behavior of the Reactive Sputtering Process

Tuesday, November 1, 2005, 4:00 pm, Room Exhibit Hall C&D

Session: Plasma Science and Technology Poster Session
Presenter: D.J. Christie, Advanced Energy Industries, Inc.
Correspondent: Click to Email

Reactive sputtering processes exhibit unique control space behavior which has been effectively explained by mathematical models. The reactive gas partial pressure can have multiple possible values for a range of reactive gas flows which leads to hysteresis in the process control space. A model which effectively explains the process dynamics consists of three coupled non-linear differential equations. Jacobian linearization of the model equations can be used to create a linearized model whose eigenvalues can be determined explicitly.@footnote 1@ Evaluation of the linearized model eigenvalues as a function of reactive gas partial pressure shows the specific partial pressures where hysteresis is likely to occur. In this work, a representative reactive sputtering process is modeled. The small (control) signal analysis and stability are correlated to the reactive gas partial pressure and flow characteristics. In particular, the real and imaginary components of the eigenvalues and the reactive gas flow are evaluated for a realistic range of reactive gas partial pressures. The points where hysteresis is expected to occur based on the two approaches (flow versus pressure, eigenvalues versus pressure) are compared. Insights on process dynamics and potential closed-loop control issues are also extracted from the linear analysis. @FootnoteText@ @footnote 1@ C. Li, J-H Hsieh, Surface and Coatings Technology 177-178, 824 (2004).