| AVS 51st International Symposium | |
| Materials Solutions for Cooling Technology Topical Conference | Monday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 2:00pm | CT-MoA1 Invited Paper Natural Power Scaling Trends in Microprocessors and Other Complex Logic E.A. Burton, Intel Corporation |
| 2:40pm | CT-MoA3 Invited Paper Challenges and Opportunities for Cooling Advanced Semiconductor Devices D. Seeger, IBM T.J. Watson Research Center |
| 3:20pm | CT-MoA5 Invited Paper Overview of the Heat Removal by Thermo Integrated Circuits (HERETIC) Program at the Defense Advanced Research Projects Agency (DARPA) D.J. Radack, Defense Advanced Research Projects Agency (DARPA) |
| 4:00pm | CT-MoA7 Invited Paper Liquid Cooling Technologies for Microprocessors T.W. Kenny, K.E. Goodson, J.S. Santiago, Stanford University, M. Munch, G. Upadhya, D. Werner, M. McMaster, Cooligy, Inc. |
| 4:40pm | CT-MoA9 Invited Paper Microfluidic Technologies for Integrated Thermal Management A. Glezer, Georgia Institute of Technology |