AVS 51st International Symposium
    Materials Solutions for Cooling Technology Topical Conference Monday Sessions
       Session CT-MoA

Invited Paper CT-MoA9
Microfluidic Technologies for Integrated Thermal Management

Monday, November 15, 2004, 4:40 pm, Room 303B

Session: Material Solutions for Chip Cooling
Presenter: A. Glezer, Georgia Institute of Technology
Correspondent: Click to Email
The development and demonstration of microfluidic-based, thermal management technologies for a diverse range of heat loads [O(10)- O(1000) W] are described. These technologies address both local and global stages of heat transport between integrated circuits and the environment into which the heat is ultimately rejected. The fluidic-based cooling approaches range from phase-change heat transport based on vibration-induced droplet atomization (VIDA) and vibration induced bubble ejection (VIBE), to controllable heat convection using micromachined synthetic air jet arrays. Examples of the implementations of these technologies include the integration of synthetic jet actuators with heat sink configurations to form an "active" heat sink, and with electronic substrates (e.g., printed wiring boards) to form an active cooling substrate (ACS), as well as the realization of compact, VIDA- and VIBE-based, phase-change heat transfer cells.