| AVS 50th International Symposium | |
| Plasma Science and Technology | Tuesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:20am | PS+TF-TuM1 Invited Paper PECVD, From the Laboratory to Mass Production J.P.M. Schmitt, Unaxis Management Incorporated, Switzerland |
| 9:00am | PS+TF-TuM3 Plasma-enhanced Deposition of Silicon and Metal Oxynitride Films in a High-density Ammonia Discharge Z.G. Xiao, T.D. Mantei, University of Cincinnati |
| 9:20am | PS+TF-TuM4 Identification of the Growth Precursors for Hydrogenated Amorphous Carbon Growth J. Benedikt, R.V. Woen, M.C.M. van de Sanden, Eindhoven University of Technology, The Netherlands |
| 9:40am | PS+TF-TuM5 Characterization of TaN Diffusion Barrier Layers Prepared by Chemical-Enhanced Physical Vapor Deposition (CEPVD) N. Li, D.N. Ruzic, University of Illinois, Urbana-Champaign |
| 10:20am | PS+TF-TuM7 Invited Paper Anisotropic Cu Deposition using Plasma Chemical Vapor Deposition M. Shiratani, K. Takenaka, M. Takeshita, M. Kita, K. Koga, Y. Watanabe, Kyushu University, Japan |
| 11:00am | PS+TF-TuM9 Pulsed-plasma Deposition of Silicon Dioxide in a High Density Oxygen Discharge Y. Qi, T.D. Mantei, University of Cincinnati |
| 11:40am | PS+TF-TuM11 Secondary Plasma Based Debris Mitigation for Next-Generation 13.5nm EUVL Sources B. Jurczyk, D.N. Ruzic, E. Vargas-Lopez, M. Neumann, M. Williams, C. Chrpbak, S. Taj, University of Illinois at Urbana-Champaign |