AVS 50th International Symposium
    Plasma Science and Technology Tuesday Sessions
       Session PS+TF-TuM

Paper PS+TF-TuM11
Secondary Plasma Based Debris Mitigation for Next-Generation 13.5nm EUVL Sources

Tuesday, November 4, 2003, 11:40 am, Room 315

Session: Plasma Enchanced Chemical Vapor Deposition
Presenter: B. Jurczyk, University of Illinois at Urbana-Champaign
Authors: B. Jurczyk, University of Illinois at Urbana-Champaign
D.N. Ruzic, University of Illinois at Urbana-Champaign
E. Vargas-Lopez, University of Illinois at Urbana-Champaign
M. Neumann, University of Illinois at Urbana-Champaign
M. Williams, University of Illinois at Urbana-Champaign
C. Chrpbak, University of Illinois at Urbana-Champaign
S. Taj, University of Illinois at Urbana-Champaign
Correspondent: Click to Email
Next-generation EUV photolithography machines (>25kW-class) require order of magnitude improvements in debris removal for component lifetime and stable operation. Discharge plasma light sources, such as the dense plasma focus, are leading candidates for EUV. The Illinois Debris-mitigation Experiment and Applications Laboratory (IDEAL) consists of a dense plasma focus discharge source operating on order of 25 J/pulse, 100 Hz rep rate, and 4 kV. Argon and Helium gases have been tested to generate plasma environmental conditions similar to that experienced by industry. The secondary-plasma-based debris mitigation technique is presented; a concept pioneered from iPVD reactors at the University of Illinois. Sputtered electrode and chamber component debris is re-ionized in the secondary plasma region and removed with the application of electric fields prior to the collection optics. A helical resonator inductive coil generates the secondary plasma with minimal coil self-biasing for decrease erosion. A dual-channel foil trap, with independently biased plates (0-1kV), collects debris from the secondary plasma region. The foil trap is positioned to vary aspect ratios from 1:1-to-16:1 to correlate with gas pressure effects. Results from in-situ high-precision quartz-crystal-oscillators, ex-situ surface characterization (XPS, Auger, Profilometry, etc.), secondary plasma characterization, and collection optic protection factors are presented for a series of mitigation schemes.