AVS 50th International Symposium
    Plasma Science and Technology Tuesday Sessions
       Session PS-TuA

Paper PS-TuA8
A Computational Investigation of Plasma and Surface Chemistry During Fluorocarbon Plasma Etching of SiO@sub 2@ in Ar/c-C@sub 4@F@sub 8@/O@sub 2@/CO Magnetically Enhanced Capacitively and Inductively Coupled Plasmas@footnote 1@

Tuesday, November 4, 2003, 4:20 pm, Room 315

Session: Dielectric Etch
Presenter: A.V. Vasenkov, University of Illinois at Urbana-Champaign
Authors: A.V. Vasenkov, University of Illinois at Urbana-Champaign
M.J. Kushner, University of Illinois at Urbana-Champaign
Correspondent: Click to Email
Gas mixtures containing Ar, c-C@sub 4@F@sub 8@, O@sub 2@, O@sub 2@, and CO are often used for the plasma etching of silicon dioxide in order to optimize the fluxes of etching, polymerizing and activating species to the substrate. Reaction mechanisms, both gas phase and surface, are required for first principle modeling of these systems to both provide insights to the plasma chemistry and to help optimize the process. In this paper, we describe a refined gas-phase reaction mechanism for low-pressure and low-temperature plasmas sustained in mixtures initially consisting of Ar/c-C@sub 4@F@sub 8@/O@sub 2@/CO/N@sub 2@ or any combination, and its application to a computational investigation of plasma properties in magnetically enhanced inductively coupled plasmas (MEICPs) and magnetically enhanced capacitively coupled plasmas (MECCPs, or MERIEs). The systemmatic dependence of ion and radical fluxes, and ion energy distributions on gas mixtures, power and pressure will be discussed. Comparisons will be made between MEICPs and MECCPs. Predictions for ion saturation current were compared to experiments MEICPs sustained in Ar/c-C@sub 4@F@sub 8@ and O@sub 2@/c-C@sub 4@F@sub 8@ for validation. Principle differences between MEICPs and MERIES is the average molecular weight of both the radicals and ions, being higher in MERIES. @FootnoteText@ @footnote 1@ Work supported by Semiconductor Research Corporation, SEMATECH and the National Science Foundation.