AVS 50th International Symposium
    Manufacturing Science and Technology Tuesday Sessions
       Session MS-TuP

Paper MS-TuP1
Perfluoroelastomer Sealing Performance in Plasma Environments

Tuesday, November 4, 2003, 5:30 pm, Room Hall A-C

Session: Poster Session
Presenter: S. Wang, DuPont Dow Elastomers, L.L.C.
Authors: S. Wang, DuPont Dow Elastomers, L.L.C.
J.M. Legare, DuPont Dow Elastomers, L.L.C.
Correspondent: Click to Email
Perfluoroelastomers (FFKM, e.g. Kalrez, etc.) are widely used as seals on semiconductor wafer processing equipment where plasma technology is applied. These processes include etching, ashing and plasma enhanced chemical vapor deposition. The seals need to exhibit good plasma resistance in order to withstand chemical attack and maintain sealing functionality. The seals must contribute minimal contamination to the process, hence particle generation and metallic contamination are of major concerns when selecting sealing materials. This paper discusses the interactions of plasma with sealing materials, and the test methods used in the evaluation, and then compares the performance of various FFKM's with varying compositions. The results indicate that conventional FFKM products, which contain carbon black or mineral fillers, are not suitable for plasma applications where both etch rate/weight loss and particle generation are critical. Unfilled FFKM's, or FFKM's with fillers that react with plasma to form volatiles, are better suited for sealing applications on semiconductor wafer processing equipment where reactive plasmas are used.