AVS 50th International Symposium
    Manufacturing Science and Technology Monday Sessions
       Session MS-MoA

Invited Paper MS-MoA9
Nanoporous Organosilicates for On-Chip Applications Using Sacrificial Macromolecular Porogens

Monday, November 3, 2003, 4:40 pm, Room 309

Session: Challenges in Advanced Materials and New Processes for Semiconductor Manufacturing
Presenter: R.D. Miller, IBM Almaden Research Center
Authors: R.D. Miller, IBM Almaden Research Center
W. Volksen, IBM Almaden Research Center
H.-C. Kim, IBM Almaden Research Center
E. Connor, IBM Almaden Research Center
J.L. Hedrick, IBM Almaden Research Center
C.J. Hawker, IBM Almaden Research Center
T. Magbitang, IBM Almaden Research Center
V. Lee, IBM Almaden Research Center
Correspondent: Click to Email
Porous organosilicates have many potential applications, including separation media, catalyst supports, high surface area materials for bio-applications and ultralow-k media for on-chip insulator applications. The latter is driven by the need for low-k insulators to minimize signal delays and crosstalk. We have studied the generation of nanoporous thin film organosilicates using sacrificial macromolecular porogens, a process that requires a tailored interaction between the pore generators and the respective matrix resin. Depending on the porogen structure, the pore generating process can be classified either as nucleation and growth or templating. Each technique produces porous materials, but the film morphologies can be quite process specific. The integration of porous organosilicates for copper interconnects puts a premium on matrix mechanical properties. These can be altered by structural variations and/or process variations. The generation, characterization and integration of porous thin organosilicate films will be discussed.