AVS 50th International Symposium
    Manufacturing Science and Technology Monday Sessions
       Session MS-MoA

Invited Paper MS-MoA5
New Processes and Materials for Environmentally Benign Semiconductor Manufacturing

Monday, November 3, 2003, 3:20 pm, Room 309

Session: Challenges in Advanced Materials and New Processes for Semiconductor Manufacturing
Presenter: F. Shadman, University of Arizona
Correspondent: Click to Email
The environmental issues are beginning to have significant impact on both the development of new processes and the application of new materials. In this presentation, some of the technical challenges and the potential solutions will be discussed. The specific examples will include: surface preparation, new dielectric materials, gaseous emissions particularly of global warming compounds, environmental bottlenecks in chemical mechanical planarization (CMP), and finally, environmental drivers for process integration in patterning and deposition of dielectrics in copper/low-k dielectric systems.