AVS 49th International Symposium
    Plasma Science Tuesday Sessions
       Session PS-TuP

Paper PS-TuP28
Reactive Sputtering in Hollow Cathodes

Tuesday, November 5, 2002, 5:30 pm, Room Exhibit Hall B2

Session: Plasma Applications
Presenter: S.I. Shah, University of Delaware
Authors: S.I. Shah, University of Delaware
A. Pradhan, University of Delaware
S. Berg, Uppsala University, Sweden
T. Nyberg, Uppsala University, Sweden
Correspondent: Click to Email
Hollow cathode sputtering, due to the enclosed geometry, presents a unique opportunities that can be favorably utilized for depositing conformal coatings on complex substrates. Additional advantages related to reactive sputtering can be obtained from such enclosed sources. We have characterized a Hollow Cathode Source (HCS) for reactive sputtering from metal targets. Deposition rates close to that of metals are obtained during reactive deposition of oxides. We will present TRIM modeling to show the effect of oblique emission of the sputtered flux on the total sputtering rate. Similar effects can be seen from reflected neutrals. No hysteresis behavior in any of the sputtering parameters, typical for reactive sputtering in planar sputtering, was observed. We will present a model which will include the consideration of the relative cathode to anode areas, redeposition of the sputtered flux, pumping speed, relative flux of the metal and the reactive gas, etc., for hollow cathodes. The model shows that reactive sputtering in a circular confined geometry can be carried out at a very high deposition rate without the complexity of a hysteresis in the sputtering parameters.