AVS 49th International Symposium
    Plasma Science Wednesday Sessions
       Session PS+TF-WeP

Paper PS+TF-WeP20
Inductive Coupled Cl@sub 2@/Ar Plasma: Experimental Investigations and Modeling

Wednesday, November 6, 2002, 11:00 am, Room Exhibit Hall B2

Session: Plasma Etching & Deposition
Presenter: A.M. Efremov, Ivanovo State University of Chemistry & Technology, Russia
Authors: A.M. Efremov, Ivanovo State University of Chemistry & Technology, Russia
D.P. Kim, Chung-Ang University, Korea
C.I. Kim, Chung-Ang University, Korea
Correspondent: Click to Email
Inductively coupled plasma in Cl@sub 2@/Ar mixtures is a widely used in microelectronics technology. The main aim of the current work was to investigate the influence of external process parameters (gas pressure and flow rate, input power density, mixture content) on internal electro-physical properties (EEDF, electron drift rate and average energy) and on a kinetic characteristics of neutral and charged active particles formation and decay (kinetic and transport coefficients). Investigations were carried out in ICP 13.56 MHz system under such condition as: gas pressure 10 - 30 mTorr, total gas flow rate 10 - 20 sccm and input power density 0.1 - 0.2 W/cm@super 3@). Analysis was carried out using both experimental and mathematical modeling technique. Experimental part included investigations using OES spectroscopy and actinometry, langmuir probe measurements and QMS analysis. Modeling algorithm was based on the simultaneous self-consistent solution of Boltzmann kinetic equation together with the balance kinetic equation of neutral and charged particles formation and decay in a quasi-steady-state approximation. A main mechanisms supporting chlorine atoms formation and decay both for volume and heterogeneous processes were analysed including a stepwise dissociation involving an excited "heavy" particles (Ar metastable atoms). A stationary mass content of plasma volume including neutral (ground-state and excited atoms and molecules) and charged (electrons, positive and negative ions) was determined under the various external process conditions.