| IUVSTA 15th International Vacuum Congress (IVC-15), AVS 48th International Symposium (AVS-48), 11th International Conference on Solid Surfaces (ICSS-11) | |
| Thin Films | Tuesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 2:00pm | TF-TuA1 Invited Paper Mechanical Properties and Stresses in Ion-Assisted Thin Films G.S. Was, University of Michigan |
| 2:40pm | TF-TuA3 Growth of Highly-Oriented CeO@sub 2@ Layers on Glass Substrates for High-Quality Poly-Si Overlayer Formation N. Sakamoto, T. Inoue, T. Suzuki, S. Shida, Iwaki Meisei University, Japan, K. Kato, Fukushima Technology Centre, Japan |
| 3:20pm | TF-TuA5 Thin Film Growth of Reactive Sputter Deposited Tungsten-Carbon Thin Films P.D. Rack, Rochester Institute of Technology, J.J. Peterson, J. Li, Advanced Vision Technologies, H.J. Rack, A.C. Geiculescu, Clemson University |
| 3:40pm | TF-TuA6 Reactive Sputter Deposition of Tungsten Nitride Thin Films C. Baker, S.I. Shah, University of Delaware |
| 4:00pm | TF-TuA7 The Impact of Residual By-Products from Tungsten Film Deposition on Process Integration due to Non-Uniformity of the Tungsten Film A. Sidhwa, STMicroelectronics, Inc. and University of Arkansas, C. Spinner, T. Gandy, S. Melosky, STMicroelectronics, Inc., W. Brown, S. Ang, H. Naseem, R. Ulrich, University of Arkansas |
| 4:20pm | TF-TuA8 Thermal Stability of Arc Evaporated Ti@sub 1-x@Al@sub x@N Thin Films A. Hörling, L. Hultman, M. Odén, Linköping University, Sweden, G. Ramanath, Rensselaer Polytechnic Institute, P.H. Mayrhofer, C. Mitterer, University of Leoben, Austria, J. Sjölén, L. Karlsson, Seco Tools, Sweden |
| 4:40pm | TF-TuA9 Evolution of Ti-3Al Film Structures and its Effect on Film Properties C.-F. Lo, D. Draper, P. McDonald, P. Gilman, Praxair-MRC |
| 5:00pm | TF-TuA10 Surface Structural Anisotropy in Sputter and Electrolytic Deposited Tantalum Films S.L. Lee, US Army Armament Research Development and Engineering Center, D. Windover, Rensselaer Polytechnic Institute |