Click a paper to see the details. Presenters are shown in bold type.
| MM-ThP1 Determination of the Young's Modulus and Residual Stress in 3C-SiC Films Using the Load-Deflection Technique J. Mitchell, C.A. Zorman, M. Mehregany, Case Western Reserve University |
| MM-ThP2 A Trench Etching Technique Using MERIE to Fabricate MEMS Accelerometers K.-W. Kok, National University of Singapore, TEMIC Automotive (Singapore) Pte Limited, W.J. Yoo, National University of Singapore |
| MM-ThP3 Micro-fabrication of a Novel n-channel Field Effect Transistor Cantilever to Sense Charge Traps M.S. Suh, G.H. Yon, Y. Kuk, Seoul National University, Korea |