| IUVSTA 15th International Vacuum Congress (IVC-15), AVS 48th International Symposium (AVS-48), 11th International Conference on Solid Surfaces (ICSS-11) | |
| Electronics | Friday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:20am | EL-FrM1 Invited Paper Copper Alloys for Interconnections in Microelectronics J.M.E. Harper, C.K. Hu, IBM T.J. Watson Research Center, K. Barmak, Carnegie Mellon University |
| 9:00am | EL-FrM3 Microstructure Evolution and Interfacial Reactions in Cu-Mg Alloy Films on SiO@sub 2@ M.J. Frederick, R. Goswami, G. Ramanath, Rensselaer Polytechnic Institute |
| 9:20am | EL-FrM4 An Investigation of Compound and Non-compound Forming Dilute Binary Cu-Alloy Thin Films A. Gungor, K. Barmak, Carnegie Mellon University, C. Cabral, C. Lavoie, J.M.E. Harper, IBM T.J. Watson Research Center |
| 9:40am | EL-FrM5 Interfaces in Copper Nanoconnections P. Heino, E. Ristolainen, Tampere University of Technology, Finland |
| 10:00am | EL-FrM6 Cu Film Deposition under Low Energy Cu Ion Bombardment K. Miyake, Saitama University, Japan, Y. Ishikawa, L. Won, M. Isshiki, Tohoku University, Japan, M. Yamashita, Seinan Industries Co., Ltd., Japan |
| 10:20am | EL-FrM7 Conductivity Issues with Cu at sub-100 nm Dimensions S.M. Rossnagel, IBM T.J. Watson Research Center, C. Inoki, T.S. Kuan, SUNY-Albany |
| 10:40am | EL-FrM8 Cu ECD: Modeling the Effects of Additives S. Sen, Rensselaer Polytechnic Institute, S. Soukane, Applied Materials, T.S. Cale, Rensselaer Polytechnic Institute |
| 11:00am | EL-FrM9 Comparison of TiN, TaN, and WN@sub x@ as Diffusion Barriers for Copper on Silicon Dioxide: Thermal Annealing and Bias Temperature Stress Tests H. Kizil, C.O. Steinbrüchel, RPI |
| 11:20am | EL-FrM10 Low-Temperature CVD of ZrB2 and CrB2 Metallic Ceramic Thin Films E.J. Klein, D.-Y. Kim, G.K. Windler, University of Illinois at Urbana-Champaign, J.-H. Sung, Novellus, D.M. Goedde, Intel, G.S. Girolami, J.R. Abelson, University of Illinois at Urbana-Champaign |