IUVSTA 15th International Vacuum Congress (IVC-15), AVS 48th International Symposium (AVS-48), 11th International Conference on Solid Surfaces (ICSS-11)
    Microelectromechanical Systems (MEMS) Thursday Sessions
       Session MM-ThA

Paper MM-ThA1
Integration of a Honeycomb Micromirror with a Surface Micromachined 2D Scanner for Improved Performance

Thursday, November 1, 2001, 2:00 pm, Room 130

Session: Fabrication and Integration Processes for MEMS
Presenter: P.R. Patterson, University of California at Los Angeles
Authors: P.R. Patterson, University of California at Los Angeles
G.-D.J. Su, University of California at Los Angeles
D. Hah, University of California at Los Angeles
M.C. Wu, University of California at Los Angeles
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We have developed a novel fabrication process to integrate lightweight single crystal silicon honeycomb micromirrors with surface micromachined 2D scanners for improved optical flatness, compared to polysilicon alone, and improved response, compared to solid (higher mass), micromirrors. The honeycomb micromirrors are formed by silicon fusion bonding of two, silicon on insulator, SOI wafers allowing for precise control of the core and facesheet thickness, here we used 25 µm and 10 µm, respectively. The core SOI wafer is patterned with hexagonal cells of 100 µm long sides and 10 µm thick walls. Design flexibility is an inherent feature of the integrated process, core and facesheet for the honeycomb may be chosen from a wide range of commercial SOI, and the actuator and mirror are developed independently and subsequently bonded with a polymer. The electrostatically actuated 2D scanner with the bonded honeycomb micromirror has a mirror area of 950 µm x 950 µm and an optical scan angle of ±6°. The reduced mass bonded honeycomb micromirror shows an increase in resonant frequency, 158Hz, over an otherwise equivalent solid bonded micromirror measured at 108Hz.