AVS 47th International Symposium
    Incorporating Principles of Industrial Ecology Wednesday Sessions

Session IE+PS+MS+SE-WeM
Environmentally Friendly Process Development

Wednesday, October 4, 2000, 8:20 am, Room 304
Moderator: D.R. Baer, Pacific Northwest National Laboratory


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  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

8:20am IE+PS+MS+SE-WeM1 Invited Paper
CVD Films as Directly Patternable Low-k Dielectrics
K.K. Gleason, H.G. Pryce Lewis, Massachusetts Institute of Technology, G.L. Weibel, C.K. Ober, Cornell University
9:00am IE+PS+MS+SE-WeM3
Characterization of Remote Plasma Clean Process for Plasma CVD Chamber
T. Tanaka, T. Nowak, M. Seamons, B.H. Kim, K. Lai, M. Cox, P. Loewenhardt, D. Silvetti, S. Shamouilian, Applied Materials Inc.
9:20am IE+PS+MS+SE-WeM4
Silicon Oxide Contact Hole Etching Process Employing Environmentally Harmonized Technique
K. Fujita, M. Hori, T. Goto, Nagoya University, Japan, M. Ito, Wakayama University, Japan
9:40am IE+PS+MS+SE-WeM5
Photocatalytic, Anti-fogging Mirror
K. Takagi, H. Hiraiwa, T. Makimoto, T. Negishi, ULVAC Japan, Ltd.
10:00am IE+PS+MS+SE-WeM6
Low-k Materials Etching in Magnetic Neutral Loop Discharge Plasma
Y. Morikawa, S. Yasunami, W. Chen, T. Hayashi, H. Yamakawa, T. Uchida, ULVAC JAPAN Ltd.