AVS 47th International Symposium
    Electronics Tuesday Sessions

Session EL-TuP
Poster Session

Tuesday, October 3, 2000, 5:30 pm, Room Exhibit Hall C & D


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Click a paper to see the details. Presenters are shown in bold type.

EL-TuP1
Polarization Effect on Copper Electroplating in Presence of Thiourea Additives
C.-L. Cheng, Y.-S. Lin, Chung-Yuan University, Taiwan
EL-TuP2
Low Temperature, Single-Source CVD of ZrB2 and HfB2 Films as Cu Diffusion Barriers and Interconnects in Next-Generation ULSI
J.H. Sung, D.M. Goedde, G.S. Girolami, J.R. Abelson, University of Illinois at Urbana-Champaign
EL-TuP3
Study of Electrical and Interfacial Properties of CVD-W/n-Si@sub 0.83@Ge@sub 0.17@/Si(001) Schottky Contacts
Y.C. Jang, K.S. Kim, D.O. Shin, Sungkyunkwan University, South Korea, K.-H. Shim, Electronics and Telecommunications Research Institute, South Korea, S. Youn, K. Roh, Y. Roh, N.-E. Lee, Sungkyunkwan University, South Korea
EL-TuP4
Work Function and Barrier Height Correlation for Al/GaAs Schottky Contacts Modified by Ultra-Thin, Doped Si and Ge Interlayers
T.A.R. Müller, M.I. Nathan, University of Minnesota, A. Franciosi, University of Minnesota and Universita' di Trieste, C.J. Palmstrom, University of Minnesota
EL-TuP5
Enhancement of Mobility with Double Delta-doped Quantum Wires by Focused Ion Beam
S. Choi, M. Leung, G. Stupian, N. Presser, The Aerospace Corporation, C. Lee, Honam University, Korea
EL-TuP6
Implantation of AlAs Etch-Stop Layers by MBE for Recessed Gate P-HEMTs
G. Zhou, W. Liu, M. Lin, Alpha Industries, Inc.
EL-TuP7
Early Growth Studies of Barium Magnesium Fluoride onto (111)-oriented Silicon Substrates
A. Martinez, W. Gomez, M. Rodriguez, University of Puerto Rico
EL-TuP8
Fabrication of Smooth Diamond Films on SiO2 by the Addition of Nitrogen to the Gas Feed in Hot-filament CVD
V. Baranauskas, A.C. Peterlevitz, Z. Jingguo, S.F. Durrant, Universidade Estadual de Campinas, Brazil
EL-TuP9
Nanocrystalline Diamond and Nano-carbon Structures Produced using a High Argon Concentration in Hot-filament CVD
V. Baranauskas, A.C. Peterlevitz, H.J. Ceragioli, S.F. Durrant, Universidade Estadual de Campinas, Brazil
EL-TuP10
Bonding Chemistry of Alternative Gate Dielectrics: Is there Really an Alternative Gate Dielectric that can Meet SIA Roadmap Expectations for Performance, Reliability and Process Integration?
G. Lucovsky, North Carolina State University
EL-TuP11
Electrical Properties of (Ba,Sr)TiO@sub 3@ Capacitors by Inductively Coupled Plasma Etching
S.-K. Choi, N.-H. Kim, E.-G. Chang, Chungang University, Korea, T.-H. Kim, YIT, Korea, C.-I. Kim, Chungang University, Korea
EL-TuP12
(1-x)SrTiO@sub 3@-xPbTiO@sub 3@ Thin Films Grown by RF Sputtering on Pt/TiN@sub X@ AND RuO/TiN@sub X@ Electrodes
E.M. Guerra, CICESE, Mexico, A.F. Cruz, IMRE, Mexico, J.S. Beltrones, UNAM, Mexico
EL-TuP13
Etching Mechanism of Y@sub 2@O@sub 3@ Thin Flims in Cl@sub 2@/Ar Plasma
Y.C. Kim, B.J. Min, Chungang University, Korea, Y.T. Kim, KIST, Korea, C.-I. Kim, Chungang University, Korea
EL-TuP14
Etch Characteristics of CeO@sub 2@ Thin Films as a Buffer Layer for the Applications of MFIS-FeRAM
C.-S. Oh, Chungang University, Korea, K.-H. Kwon, Hanseo University, Korea, T.-H. Kim, YIT, Korea, C.-I. Kim, Chungang University, Korea
EL-TuP15
The Interface Formation of Ta and Low-k Plasma-polymerized Para-xylene (PPpX) and Cyclohexane (PPCHex) and the Diffusion Properties
K.J. Kim, K.S. Kim, Y.C. Jang, G.Y. Yeom, N.-E. Lee, Y.C. Quan, J. Choi, C.Y. Park, D.-Y. Jung, Sungkyunkwan University, South Korea
EL-TuP16
Structure Effects of Pendant Groups on Dielectric Constant and Thermal Properties of Polyimides
L.-Y. Wang, National Taiwan University, P. Chang, C.-L. Cheng, Chung-Yuan University, Taiwan