AVS 47th International Symposium
    Plasma Science and Technology Thursday Sessions
       Session PS1+TF+SE-ThM

Invited Paper PS1+TF+SE-ThM7
Fundamentals of Plasma Enhanced Chemical Vapor Deposition

Thursday, October 5, 2000, 10:20 am, Room 310

Session: Fundamentals of Plasma Enhanced Chemical Vapor Deposition
Presenter: J. Meichsner, Ernst-Moritz-Arndt-University Greifswald, Germany
Correspondent: Click to Email
Applications of non-isothermal plasmas for chemical vapor deposition and plasma surface modification imply the understanding of the fundamental problem: the plasma-surface interaction. From the plasma physics point of view the transition between the gas plasma and the solid state is characterized by the plasma sheath in front of the surface which controls the flux and kinetic energy of the charged particles. Additionally, in a reactive molecular plasma the complex chemical reactions must be taken into account in the gas phase and at surfaces. Depending on nature of molecular gases, surface material and plasma properties the modification of a thin surface layer, etching or thin film deposition may be found simultaneously on electrodes, immersed samples or surrounding walls. In-situ diagnostic tools are preferably qualified to provide detailed information about processes in the gas plasma and at surfaces. The experimental investigations involved plasma diagnostics by means of optical spectroscopy (OES, LIF) and mass spectrometry (energy selective ion analysis, electron attachment mass spectrometry) as well as surface and thin film characterization using special methods of FTIR-spectroscopy (IRRAS, ATR, fiber based), ellipsometry and microgravimetry. In a low pressure rf-discharge of Hexamethyldisiloxane the chemical conversion of the monomer gas into new stable gas molecules and deposition of a thin organic film were investigated in dependence on characteristic process parameters. The changed atomic composition and molecular structure of the organic films were connected with varied film properties interesting for semipermeable membranes, photo-conducting films, optical or protective coatings. In fluorocarbon plasmas the investigation of the Polyethylene and Polystyrene surface modification as well as thin film deposition revealed the dynamics between incorporation of atoms/molecules and etching of surface material.