Invited Paper PS-MoM1
Plasma-Assisted Etching Processes for Dielectric Materials: Technological Challenges and Elementary Processes on Planar Surfaces and in Microstructures
Low pressure discharges are used for pattern transfer into dielectric layers in integrated circuit production, e.g. for etching of vias and trenches in the formation of multi-level interconnection schemes. The dielectric materials range from conventional SiO@sub 2@ and different spin-on glass films, organic insulators to porous materials. The control of plasma-surface interactions is a prerequisite for successful pattern transfer into the dielectric materials. We will review the challenges that exist for several prototypical pattern transfer applications, the dominant plasma-surface interaction mechanisms, and the technological solutions that have been demonstrated.