| AVS 46th International Symposium | |
| Thin Films Division | Monday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 2:00pm | TF-MoA1 Plasma Interaction Effects in Ion-Beam Assisted Pulsed Laser Deposition of Al-O-N Films A.A. Voevodin, J.G. Jones, J.S. Zabinski, Air Force Research Laboratory |
| 2:20pm | TF-MoA2 Time-of-Flight Measurements of Sputtered Species using Novel Pulsed High Plasma Density Magnetron Discharge K. Macák, V. Kouznetsov, J.M. Schneider, U. Helmersson, Linköping University, Sweden, I. Petrov, University of Illinois, Urbana |
| 2:40pm | TF-MoA3 Modeling of I-PVD Systems for TiN Film Deposition in Inductively Coupled Plasmas M. Li, D.B. Graves, University of California at Berkeley |
| 3:00pm | TF-MoA4 Invited Paper Origin and Evolution of Sculptured Thin Films R. Messier, V.C. Venugopal, P.D. Sunal, H. Maeda, Penn State University |
| 3:40pm | TF-MoA6 Ionized Physical Vapor Deposition (PVD) using Hollow-Cathode Magnetron (HCM) Source for Advanced Metallization E. Klawuhn, G.C. D'Couto, K.A. Ashtiani, P. Rymer, M.A. Biberger, K.B. Levy, Novellus Systems, Inc. |
| 4:00pm | TF-MoA7 Gas Phase Dynamics of Copper Ionized Metal Plasmas Y. Andrew, I.C. Abraham, Z. Lu, T.G. Snodgrass, A.E. Wendt, J.H. Booske, University of Wisconsin, Madison, P.L.G. Ventzek, S. Rauf, Motorola |
| 4:20pm | TF-MoA8 Effects of Copper Seedlayer Deposition Method for Electroplating E.C. Cooney III, D.C. Strippe, J.W. Korejwa, IBM Microelectronics |
| 4:40pm | TF-MoA9 Steel Coating by Self-induced Ion Plating, a New High Throughput Metallization Ion Plating Technique P. Vanden Brande, A. Weymeersch, Cockerill Sambre - RDCS, Belgium |
| 5:00pm | TF-MoA10 Analysis of Mode Transistions in I-PVD and Conventional PVD Reactive Sputtering of Refractive Diffusion Barrier Materials D.R. Juliano, R. Ranjan, D.N. Ruzic, J. Norman, University of Illinois, Urbana-Champaign |