| AVS 46th International Symposium | |
| Plasma Science and Technology Division | Thursday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 2:00pm | PS2-ThA1 Invited Paper Power Modulated, Inductively-Coupled Plasmas M.V. Malyshev, V.M. Donnelly, J.I. Colonell, K.H.A. Bogart, Bell Laboratories, Lucent Technologies, S. Samukawa, NEC Corporation, Japan |
| 2:40pm | PS2-ThA3 Method for Ion Energy and Ion Energy Distribution Functions Control at the Substrate during Plasma Processing S.-B. Wang, A.E. Wendt, University of Wisconsin, Madison |
| 3:00pm | PS2-ThA4 Modulation Frequency Effects on Metal Etching Processes Using Pulsed-Power Plasma of Cl@sub 2@/BCl@sub 3@ Admixture C.J. Choi, O.S. Kwon, Y.S. Seol, I.H. Choi, Hyundai Electronics Industries Co., Ltd., Korea |
| 3:20pm | PS2-ThA5 Invited Paper Characterization of Process-Induced Charging Damage in Scaled-Down Devices and Reliability Improvement using Time-Modulated Plasma K. Noguchi, S. Samukawa, H. Ohtake, T. Mukai, NEC Corporation, Japan |
| 4:00pm | PS2-ThA7 Reduction and/or Elimination of Undesirable Topographic Differential Charging Effects in Semiconductor Processing by using Simultaneous Modulation of Source and Wafer RF N. Hershkowitz, University of Wisconsin, Madison, M.K. Harper, Intel Corporation, B.-W. Koo, University of Wisconsin, Madison |
| 4:20pm | PS2-ThA8 Time-Resolved Optical Measurements of a Pulsed Inductively Coupled Plasma E.C. Benck, M. Edamura, National Institute of Standards and Technology |
| 4:40pm | PS2-ThA9 Substrate and Plasma Heating within High Frequency Bi-polar Pulsed-DC Magnetron Sputtering Applications L.J. Mahoney, G.W. McDonough, D.C. Carter, G.A. Roche, H.V. Walde, Advanced Energy Industries |