AVS 46th International Symposium
    Plasma Science and Technology Division Tuesday Sessions
       Session PS-TuM

Paper PS-TuM10
Measurements and Modeling of the Absolute Sputtering Yield of Nitrided and Non-nitrided Diffusion/Barrier Film Materials with Incident N+ and Ar+

Tuesday, October 26, 1999, 11:20 am, Room 609

Session: Plasma-Surface Interactions I
Presenter: R. Ranjan, University of Illinois, Urbana-Champaign
Authors: R. Ranjan, University of Illinois, Urbana-Champaign
M.H. Hendricks, University of Illinois, Urbana-Champaign
J.P. Allain, University of Illinois, Urbana-Champaign
D.N. Ruzic, University of Illinois, Urbana-Champaign
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The angular distribution of sputtered material and the absolute sputtering yield of metal targets by argon ions at energies less than 1000 eV has been measured in previous work for a number of materials.@footnote 1@ The application of TiN and TaN films for both diffusion barrier and enhanced metallization properties has grown in the advent of copper metallization. The conformal nature of such diffusion barriers has been addressed with the advancement of IPVD magnetron sputtering systems. In order to understand the physical processes on magnetron targets used in such systems, an experiment in the Ion-surface InterAction Experiment (IIAX) facility has been designed to measure the absolute sputtering yield of nitrided and non-nitrided barrier/seed layer material targets with incident N and Ar ions. A Coultron ion source is used to create and accelerate gaseous ions onto a 100 mm@super 2@ metal target. The bombarding ions are mass-selected through an E X B filter and decelerated near the target. The target can be rotated in order to provide variation in the angle of incidence. A plasma cup is used to remove the first few monolayers and thus provide a "clean" surface. This method also provides for "nitriding" the layer on the target surface. A newly designed dual quartz crystal oscillator unit is rotated in front of the target to collect the sputtered flux measuring the absolute sputtering yield. Modeling is performed by VFTRIM3D, an enhanced version of TRIM, a Monte Carlo code which includes fractal geometry and a non-binary collision model.@footnote 2@ @FootnoteText@ @footnote 1@ P.C. Smith, D.N.Ruzic, submitted, J. Vac. Sci. Technol.A @footnote 2@ D.N.Ruzic, Nuclear Instrum. and Methods in Phys. Res. B47 (1990) pp.118-125