AVS 46th International Symposium
    Plasma Science and Technology Division Wednesday Sessions
       Session PS+SS-WeA

Paper PS+SS-WeA5
Ion Solid Surface Interactions in IMP Cu PVD

Wednesday, October 27, 1999, 3:20 pm, Room 612

Session: Ion-Surface Interactions II
Presenter: X.-Y. Liu, Motorola Semiconductor Products Sector
Authors: X.-Y. Liu, Motorola Semiconductor Products Sector
M.S. Daw, Motorola Semiconductor Products Sector
D.G. Coronell, Motorola Semiconductor Products Sector
V. Arunachalam, Motorola Semiconductor Products Sector
C.-L. Liu, Motorola Semiconductor Products Sector
J.D. Kress, Los Alamos National Laboratory
D.E. Hanson, Los Alamos National Laboratory
A.F. Voter, Los Alamos National Laboratory
Correspondent: Click to Email
A thorough understanding of ion-solid surface interactions is important for predictive modeling of ionized mass plasma (IMP) Cu physical vapor deposition (PVD) at feature scales. Besides sticking coefficients and sputter yields, fundamental parameters such as angular distributions of sputtered and reflected particles, and thermal accommodation coefficient are also needed as inputs for the feature scale process simulator. Molecular dynamics (MD) simulations can be used to provide pertinent information and physical insights. In this presentation, we'll demonstrate our recent MD results for Ar+/Cu and Cu+/Cu systems, as a function of hyperthermal ion energies and impact angles. The issue of integrating different sticking coefficients for different surface "roughness" will be addressed, based on ion travel distance analysis. We have found that the sputtered particle distributions are not cosine, but can be described by a simple Gaussian-like formula. Reflection characteristics were also analyzed and compared with simple analytical assumptions. Finally, the existing trends in the MD results from the systems will be discussed in terms of interaction strength, ion energy and impact angle.