| 8:20am |
TF-FrM1
Annealing of Copper Electrodeposits
C.H. Seah, S. Mridha, Nanyang Technological University, Republic of Singapore, L.H. Chan, Chartered Semiconductor Manufacturing Ltd., Republic of Singapore |
| 8:40am |
TF-FrM2
Polymerized C-Si Films on Metal Substrates: Cu Adhesion/Diffusion Barriers for ULSI?
L. Chen, J.A. Kelber, University of North Texas |
| 9:00am |
TF-FrM3 Invited Paper
Ultra High Rate, Wide Area, Plasma Polymerized Films from High Molecular Weight/Low Vapor Pressure Liquid or Solid Monomer Precursors
J.D. Affinito, M.E. Gross, P.A. Mounier, S. Stockhause, Pacific Northwest National Laboratory |
| 9:40am |
TF-FrM5
Effects of Temperature (350 - 25°C) on OH Incorporation and Electrical Performance of Plasma Deposited Silicon Dioxide Thin Films for Applications on Plastic Substrates
A. Gupta, C.G. Makosiej, G.N. Parsons, North Carolina State University |
| 10:00am |
TF-FrM6
Structural and Electrical Properties of SrTiO@sub 3@ Thin Films Prepared by Plasma Enhanced MOCVD
D.O. Kim, Y-.B. Hahn, Chonbuk National University, Korea |
| 10:20am |
TF-FrM7
Thermal Stability of MOCVD TiN/PECVD SiOF Interface for Cu Metallization
K.H. Kim, S.J. Park, G.S. Lee, Louisiana State University |
| 10:40am |
TF-FrM8
Assessment of As-deposited Polycrystalline Silicon Films on Polymer Substrates using ECR-PECVD
S.H. Bae, S.J. Fonash, The Pennsylvania State University |
| 11:00am |
TF-FrM9
A Novel Method For Determining Kinetic Rate Expressions For CVD Processes Using a Combination of Step Coverage Measurements and Computer Simulation
E.J. McInerney, G. Ramanath, D.C. Smith, Novellus Systems |