| AVS 45th International Symposium | |
| Plasma Science and Technology Division | Monday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 2:00pm | PS1-MoA1 Scaling of PFC Abatement Using Plasma Burn-Boxes@footnote 1@ X. Xu, M.J. Kushner, University of Illinois, Urbana-Champaign |
| 2:20pm | PS1-MoA2 Point-of-Use Plasma Abatement of PFCs in a High Density Inductively Coupled Plasma D.B. Graves, E.J. Tonnis, University of California, Berkeley |
| 2:40pm | PS1-MoA3 Invited Paper Plasma Etching Using PFC Replacement Chemicals T. Kure, Hitachi Ltd., Japan, T. Takaichi, Showa Denko K.k., Japan, Y. Goto, Hitachi Ltd., Japan |
| 3:20pm | PS1-MoA5 Invited Paper Challenges in Plasma Etching and Patterning for Fabrication of New Systems and Devices M. Engelhardt, Siemens AG, Germany |
| 4:00pm | PS1-MoA7 Invited Paper PECVD and Dry Etching on Large Glass Substrates for Flat Panel Displays J.M. Perrin, Balzers Process Systems, France |
| 4:40pm | PS1-MoA9 Use of a One Atmosphere Uniform Glow Discharge Plasma (OAUGDP) to Kill a Broad Spectrum of Microorganisms@footnote 1@ K. Kelly-Wintenberg, A. Hodge, T.C. Montie, L. Deleanu, J.R. Roth, D. Sherman, University of Tennessee, P. Tsai, L. Wadsworth, Textile and Nonwovens Development Center (TANDEC) |
| 5:00pm | PS1-MoA10 High Pressure Plasmas as an Anti-Terrorist Technology G.S. Selwyn, H.W. Herrmann, I. Henins, Los Alamos National Laboratory |