AVS 45th International Symposium
    Thin Films Division Wednesday Sessions
       Session TF-WeA

Paper TF-WeA6
Suppression of Hillocks and Whiskers on Al Films Deposited onto a Glass

Wednesday, November 4, 1998, 3:40 pm, Room 310

Session: Advances in Sputtering
Presenter: H. Saka, Nagoya University, Japan
Authors: H. Saka, Nagoya University, Japan
Y. Suzuki, Nagoya University, Japan
H. Takatsuji, IBM, Japan
K Tsujimoto, IBM, Japan
K. Kuroda, Nagoya University, Japan
S. Tsuji, IBM, Japan
Correspondent: Click to Email
A new technique to suppress formation of hillocks and whiskers on an Al film deposited onto a glass substrate has been developed. First, an Al film was deposited on a LCD-grade glass substrate by industrially conventional dc magnetron sputtering. Heating this films above 573K resulted in formation of a number of hillocks and whiskers. Onto this Al film another layer of Al film was deposited by rf magnetron sputtering. When the thickness of the second Al layer is very thin, many hillocks and whiskers are formed on heating. However, when the thickness of the second Al layer is around 40nm, the formation of both hillocks and whiskers are completely suppressed. Cross-sectional TEM observation revealed that the second layer of Al deposited by rf sputtering is amorphous. The sheet resistance of the second layer was measured by van der Pauw method to be 3.5 x 10@super-6@ ohm cm.