AVS 45th International Symposium
    Surface Science Division Wednesday Sessions
       Session SS1-WeA

Paper SS1-WeA6
Surface Electromigration Processes on Gold and Copper Films

Wednesday, November 4, 1998, 3:40 pm, Room 308

Session: Electromigration and Surface Transport
Presenter: N. Shimoni, The Hebrew University, Israel
Authors: N. Shimoni, The Hebrew University, Israel
O. Biham, The Hebrew University, Israel
O. Millo, The Hebrew University, Israel
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Electromigration processes on the surfaces of gold and copper films are studied using scanning tunneling microscopy (STM). We perform time-lapse STM scans under controlled sample temperature conditions, both with and without current stressing. We shall present results regarding the following issues: 1. The evolution of monolayer islands, voids and terraces on the surface of polycrystalline gold films. 2. The appearance and evolution of surface dislocations on flame-annealed gold films. 3. Grain boundary migration, and elongation of surface grains in the direction of the applied current in copper films. Our results will be discussed in context of the various possible surface dynamic processes, including the affect of the sub-surface layer on these dynamics. We will also address differences between thermally activated and electromigration induced processes.