AVS 45th International Symposium
    Manufacturing Science and Technology Group Wednesday Sessions
       Session MS-WeA

Invited Paper MS-WeA5
Process Module Control Technology for 300mm Plasma Processing

Wednesday, November 4, 1998, 3:20 pm, Room 317

Session: Process Control and Yield from Tool to Factory
Presenter: F. Kaveh, Lam Research Corporation
Authors: F. Kaveh, Lam Research Corporation
B. McMillin, Lam Research Corporation
W. Collison, Lam Research Corporation
Correspondent: Click to Email
In order to meet the challenge posed by the processing of the 300mm wafers, and the move toward sub quarter micron feature sizes, a new hybrid etch tool control architecture has been devised. This new architecture, based on TI's ControlWORKS environment, has enabled close coupling of a number of feedback loops for control of equipment level parameters, as well as control of stand alone remote sub-systems. Through the use of VME based direct I/O, for fast loops, and LonWorks network for less time critical loops, effective partitioning and optimization of the control functions has been achieved . Through the digitization and integration of a number of the process control loops such as the match and pressure controllers, measurable improvements in the overall operation of the tool has been realized. Further, a structure has been put in place that allows further integration of the aforementioned loops, and implementation of outer loops, for plasma state control applications. The new architecture is highly flexible, and as such, has enabled the integration of various sensors, such as an optical emission spectrometer, and a low cost RGA. These sensors are being used for detailed characterization of the chamber and the plasma, and are expected to result in significant gains in tool productivity and performance.