AVS 45th International Symposium
    Manufacturing Science and Technology Group Wednesday Sessions
       Session MS-WeA

Invited Paper MS-WeA3
Advanced Process Control and Sensor Requirements for Reducing Non-Product Wafer Usage and to Increase Tool OEE in 300mm Manufacturing

Wednesday, November 4, 1998, 2:40 pm, Room 317

Session: Process Control and Yield from Tool to Factory
Presenter: M.L. Passow, IBM Corporation
Authors: M.L. Passow, IBM Corporation
J. Pace, IBM Corporation
Correspondent: Click to Email
To maintain productivity in leading edge manufacturing, shrinking feature sizes and increases in equipment productivity are necessary. The shift from 200mm diameter wafers to 300mm diameter wafers is required, but not sufficient. Improvements in equipment OEE and reductions in the usage of non-product (NP) wafers and SAHD wafers must be made as the cost of using conventional methods of control in new, fully automated 300mm fabs is too high. Based on learning gained by understanding NP wafer usage in 200mm development and manufacturing lines, areas with the highest potential benefit from various reduction strategies will be identified. Process tool suppliers will be requested to incorporate Advanced Process Control (APC) strategies where possible. Adherence to standards will be required to facilitate the adaptation of new sensor, APC, data collection, and line management strategies to meet these needs. Particular recommendations will be presented.