Pacific Rim Symposium on Surfaces, Coatings and Interfaces (PacSurf 2014)
    Thin Films Wednesday Sessions

Session TF-WeP
Thin Films Poster Session

Wednesday, December 10, 2014, 4:00 pm, Room Mauka


  Click here to Download program book for this session  
  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

TF-WeP1
Inductively Coupled Ar-Based Plasma Etching of Palladium for Low Damage in Underlying GaN Semiconductor
Yong-Yeon Kim, J.K. Kim, J.M. Lee, Sunchon National University, Republic of Korea
TF-WeP2
Effect of Copper Layer Thickness on the Thermal Performance of LED Ceramic Package Substrate
HyunMin Cho, S. Jang, S. Ha, KETI, Republic of Korea
TF-WeP3
Characteristics of Al, Ag, and Cu Metal Mesh Prepared by Photolithography for Touch Screen Panels
M.J. Kim, Pungkeun Song, S.H. Cho, Pusan National University, Republic of Korea
TF-WeP4
Improved Initial Growth Behavior of Atomic Layer Deposited SrTiO3 Films with [Sr(demamp)(tmhd)]2 as Sr-precursor
Woongkyu Lee, W. Jeon, Y.W. Yoo, C.H. An, M.J. Chung, Seoul National University, Republic of Korea, T.-M. Chung, B.K. Park, S.M. George, C.G. Kim, Korea Research Institute of Chemical Technology, C.S. Hwang, Seoul National University, Republic of Korea
TF-WeP5
Nanoscale Wrinkle Structures on Polydimethylsiloxane using Ion-Beam Bombardment
JuHwan Lee, H.-G. Park, H.-C. Jeong, Y.H. Jung, D.-S. Seo, Yonsei University, Republic of Korea
TF-WeP6
Molecular Arrangements and Electronic States of Well-Defined K-Doped Coronene and Picene Monolayers
Masahiro Yano, M. Endo, R. Shimizu, Y. Hasegawa, Y. Yamada, M. Sasaki, University of Tsukuba, Japan
TF-WeP7
Failure Behaviors of Stretchable Electrodes Based on Metal Nanostructure Percolation Networks
Guh-Hwan Lim, H. Sim, B. Lim, Sungkyunkwan University, Korea, Republic of Korea
TF-WeP8
Properties of Photo-Induced Hybrid Channel Thin-Film Transistors Via Solution Process
YoonHo Jung, H.-G. Park, H.-C. Jeong, D.-S. Seo, Yonsei University, Republic of Korea
TF-WeP9
Uniform Alignment of Liquid Crystal Molecules on Solution-Based Oxide Films
Hae-Chang Jeong, H.-G. Park, D.-S. Seo, Yonsei University, Republic of Korea
TF-WeP10
Fabrication of SiC based AFM Cantilever for NSOM Application
S.-H. Nam, K.-H. Hwang, J.H. Yu, Jinsu Lee, J.-H. Boo, Sungkyunkwan University, Republic of Korea
TF-WeP11
Reliability and Life Time Flexible OLED Device Fabricated on ITO/Ag NW/ITO Thin Film on PES Substrate
WooJin Yeon, Y.T. Oh, K.H. Kim, E.S. Kim, DongChan. Shin, Chosun University, Republic of Korea
TF-WeP12
A Study of the Mechanical Properties of Trench Type Cu/Mo Thin Films for Flexible Copper Interconnect
JongHyun Seo, Korea Aerospace University, Republic of Korea, H.-S. Kim, Korea Aerospace University, HH. Choe, J.-H. Jeon, J.H. Yoon, Korea Aerospace University, Republic of Korea
TF-WeP14
Computational Simulation Study on Structure Change of Si-DLC Films
Takeshi Tsuruda, H. Murabayashi, Y. Wang, Y. Kobayashi, T. Kuwahara, S. Bai, Y. Higuchi, N. Ozawa, K. Adachi, Tohoku University, Japan, J.M. Martin, Ecole Centrale de Lyon, France, M. Kubo, Tohoku University, Japan
TF-WeP15
Tight-Binding Quantum Chemical Molecular Dynamics Simulation on Chemical Reaction of Molybdenum Dithiocarbamate on DLC surface
Hiroki Murabayashi, T. Tsuruda, Y. Wang, Y. Kobayashi, S. Bai, Y. Higuchi, N. Ozawa, K. Adachi, Tohoku University, Japan, J.M. Martin, Ecole Centrale de Lyon, France, M. Kubo, Tohoku University, Japan
TF-WeP20
Lifetime Calculation of Encapsulated Oganic Device Under Specific Weather Conditions
Namsu Kim, Korea Electronics Technology Institute (KETI), Republic of Korea, D. Kim, Korea Electronics Technology Institute (KETI), K. Hwang, University of California at San Diego, S. Graham, Georgia Institute of Technology, S. Kim, Korea Electronics Technology Institute (KETI)
TF-WeP22
Spin Valve Junctions Based on Fe3Si/FeSi2/Fe3Si Trilayered Films
Tsuyoshi Yoshitake, Kyushu University, Japan, K. Sakai, Kurume National College of Technology, Japan, Y. Asai, K. Ishibashi, Y. Noda, Kyushu University, Japan, K. Takeda, Fukuoka Institute of Technology
TF-WeP23
Application of Double-Lorentzian Line-Shape in XPS Analysis of Metallic Zn and ZnO Thin Films.
Gabriela Molar-Velazquez, G. Gomez-Sosa, A. Herrera-Gomez, CINVESTAV-Unidad Queretaro, Mexico
TF-WeP25
Double-Lorentzian Line Shape in XPS Analysis of Metallic Nickel, Chromium, Cobalt and Their Oxide Films
Gustavo Gomez-Sosa, J.A. Torres-Ochoa, M. Bravo-Sanchez, J.H. Mata-Salazar, D. Cabrera- German, J. Ibarra-Nuno, A. Herrera-Gomez, CINVESTAV-Unidad Queretaro, Mexico
TF-WeP26
Improved Adhesion of Diamond-Like Carbon Films by r.f. Plasma CVD Process with Cylindrical Electrode
Keisuke Shiba, Tokyo Denki University, Japan, Y. Ohgoe, Tokyo Denki University, M. Hiratsuka, Nanotec Corporation, K. Ozeki, Ibaraki University, K. Hirakuri, K. Sato, Tokyo Denki University, Japan
TF-WeP28
Inductively Coupled Plasma Reactive Ion Etching of CoFeB Thin Films Using a CH3COOH/Ar Gas Mixture
Adrian Garay, S.M. Hwang, J.H. Choi, C.W. Chung, Inha University, Korea
TF-WeP29
Electronic Transmission of Two, Three and Four Magneto-Electrostatic Barriers on Graphene: An Approach to Diode, Transistor and Thyristor.
R.A. Reyes Villagrana, Jesús Madrigal Melchor, J.R. Suárez López, I. Rodríguez Vargas, Universidad Autónoma de Zacatecas, México
TF-WeP32
Influence of Deposition Conditions on the Structural and Optical Properties of nc-Si/SiO2 Films in SiOx Matrix using HW-CVD
Ateet Dutt, Matsumoto, Centro de Investigación y de Estudios Avanzados del IPN, Mexico, Santana-Rodríguez, Universidad Nacional Autónoma de México, Mexico, Santoyo Salazar, Godavarthi, Centro de Investigación y de Estudios Avanzados del IPN, Mexico
TF-WeP34
Chemically Enhanced Raman Scattering of Rhodamine 6 G Molecule Adhere to Graphene, MoS2 and WSe2: Efficiency Variation determined by Pressure and Charge Transfer
Hyunmin Kim, Daegu Gyeongbuk Institute of Science and Technology, Korea, Y. Lee, Sungkyunkwan University, Korea, S.M. Jeong, Daegu Gyeongbuk Institute of Science and Technology, Korea, J.H. Cho, Sungkyunkwan University, Korea, J.-H. Ahn, Yonsei University, Korea
TF-WeP36
Negative Thermal Expansion of Polystyrene Ultrathin Films Supported on Si Substrates revealed by X-Ray Reflectivity: Quench Rate Dependence
Kazuki Nishimori, S. Nakahara, K. Sekiya, Kwansei Gakuin University, Japan, Y. Chunming, Shanghai Institute of Applied Physics, China, I. Takahashi, Kwansei Gakuin University, Japan
TF-WeP37
Large-Scale Laser Scribing of Complex Motifs
Goran Rasic, North Carolina Central University
TF-WeP38
Probing Ni(111)-graphene interface using Raman spectroscopy
Guanjun Cheng, I. Calizo, A.R. Hight-Walker, National Institute of Standards and Technology
TF-WeP40
High Temperature Self-Lubricant Coatings with Release of a Lubricious Agent for Machining Applications
F. Fernandes, University of Coimbra, Portugal, T. Polcar, University of Southampton, UK, Albano Cavaleiro, University of Coimbra, Portugal