Pacific Rim Symposium on Surfaces, Coatings and Interfaces (PacSurf 2014)
    Thin Films Wednesday Sessions
       Session TF-WeP

Paper TF-WeP2
Effect of Copper Layer Thickness on the Thermal Performance of LED Ceramic Package Substrate

Wednesday, December 10, 2014, 4:00 pm, Room Mauka

Session: Thin Films Poster Session
Presenter: HyunMin Cho, KETI, Republic of Korea
Authors: H. Cho, KETI, Republic of Korea
S. Jang, KETI, Republic of Korea
S. Ha, KETI, Republic of Korea
Correspondent: Click to Email
LED(Light Emitting Diode) has been one of the promising technology for the energy saving. Now, conventional lamps such as incandescent and fluorescent lamps are rapidly being replaced by LED lamps. By the progress of LED technologies, the efficiency and reliability of LED devices have been dramatically increased compared to decade ago. Also, the power of LED lightings have been increased. To maintain LED performance, it is very important to manage heat from the LED chip. To deal with high power LED chip over 3 W or COB(Chip on Board) type arrayed LED chips over 10 W, ceramic substrate such as aluminum nitride has been adopted instead of plastic or aluminum oxide substrate because of its high thermal conductivity in the range of 170~250 W/m.K. For the metal circuit pattern on the substrate, mainly copper is used for the high thermal and electrical conduction. We investigated the effect of metal layer thickness on the thermal performance of high power LED package. First we simulated the junction temperature of LED package according to copper layer thickness. The decrease of LED junction temperature was occurred with the increase of metal layer thickness. But, the effect was reduced with higher thickness. We also manufactured LED packages with various copper layer thicknesses and tested thermal performance by thermal transient measurement and compared with the simulation data. With this results, we could optimize the copper layer thickness of the LED package substrate.