AVS 64th International Symposium & Exhibition
    Plasma Science and Technology Division Tuesday Sessions
       Session PS-TuP

Paper PS-TuP16
Improvement of Adhesion Strength between Copper and Composite Materials using Plasma Press Method

Tuesday, October 31, 2017, 6:30 pm, Room Central Hall

Session: Plasma Science and Technology Poster Session
Presenter: DooSan Kim, Sungkyunkwan University, Republic of Korea
Authors: D.S. Kim, Sungkyunkwan University, Republic of Korea
W.O. Lee, Sungkyunkwan University, Republic of Korea
J.W. Park, Sungkyunkwan University, Republic of Korea
M.K. Mun, Sungkyunkwan University, Republic of Korea
K.S. Kim, Sungkyunkwan University, Republic of Korea
K.H. Kim, Sungkyunkwan University, Republic of Korea
Y.J. Ji, Sungkyunkwan University, Republic of Korea
J.S. Oh, Sungkyunkwan University, Republic of Korea
G.Y. Yeom, Sungkyunkwan University, Republic of Korea
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Adhesion is one of the important issues for the wearable, attachable, and implantable devices. Especially, adhesion strength between hetero interfaces is very important. Various methods such as hot press, UV curing, thermal curing, and hot press after plasma treatment have been investigated to improve adhesion strength between different interfaces. But, for flexible devices, the adhesion strength obtained by these existing methods adhesion appear not enough and a higher adhesion force is required. In this study, in order to improve the adhesion strength between hetero interfaces, a novel plasma press method was introduced, and where, two interfaces are press bonded while plasma is on. The experiment was conducted in order to improve the adhesion strength between prepreg (Prepreg is a polymer substrate contained resin. Prepreg was also used as an insulating layer) and copper foil. These materials are used for the fabrication of multilayer flexible printed circuit board (PCB) substrate. The adhesion measurement was conducted by a peel off test. The plasma press method improved adhesion strength about 75 % compared to the conventional hot press method. The stronger bond for the plasma press is believed to be related to the formation of active carboxyl functional groups and unsaturated dangling bonds on the materials surfaces by the plasma operating during the hot press for bonding.