AVS 64th International Symposium & Exhibition | |
Plasma Science and Technology Division | Thursday Sessions |
Session PS+VT-ThA |
Session: | Plasma Diagnostics, Sensors and Control |
Presenter: | Shota Nunomura, National Institute of Advanced Industrial Science and Technology (AIST), Japan |
Correspondent: | Click to Email |
The plasma processing is a key technology for fabricating semiconductor devices such as solar cells, light-emitting diodes and transistors. In those devices, the semiconductor films are often prepared and/or post-processed by various plasma processes. During the processes, the films are exposed into the UV, radicals, and ions, and thereby the electronic property of the films is often degraded. So, the investigation of the plasma-material interaction is important for understanding the degradation mechanism and also for further developing the plasma processing technology.
Here, we show in-situ characterization of the electronic property of semiconductor films as well as the gas-phase plasma diagnostics during the plasma process. The process we diagnosed was PECVD of hydrogenated amorphous silicon (a-Si:H) for the passivation of silicon heterojunction solar cells. The plasma parameters and gas-phase spices, such as ions, radicals, and precursors are measured by using conventional techniques of Langmuir probe, quadrupole mass spectroscopy and optical emission spectroscopy [1-3]. Together with this gas-phase diagnostics, we measured the transport properties of the growing a-Si:H films such as carrier transport and trapping, by using a recently developed optical pump probe technique [4,5]. The optical property such as the bandgap, refractive index and extinction coefficient, was also characterized by real-time spectroscopic ellipsometry.
We found that transport property of the a-Si:H films was strongly limited by the defects generated during the PECVD process, and improved by post-deposition annealing process. The generated defects were distributed near the film surface; the defect rich surface layer was estimated to be less than approximately 10 nm. As for defect annihilation, the post deposition annealing was very efficient. The annealing temperate and period strongly influence the defect relaxation, inducing the improved carrier transport. The relation between the plasma process and transport property will be described in the presentation.
[1] S. Nunomura, I. Yoshida, and M. Kondo, Appl. Phys. Lett. 94, 071502 (2009). [2] S. Nunomura and M. Kondo, J. Appl. Phys. 102, 093306 (2007). [3] S. Nunomura. H. Katayama I. Yoshida, Plasma Sources Sci. Technol. 26, 055018 (2017). [4] S. Nunomura, I. Sakata, and M. Kondo, Appl. Phys. Express 6, 126201 (2013). [5] S. Nunomura and I. Sakata, AIP Advances 4, 097110 (2014).