AVS 64th International Symposium & Exhibition
    Plasma Science and Technology Division Thursday Sessions
       Session PS+VT-ThA

Paper PS+VT-ThA10
Towards In Situ Microwave Imaging in Plasmas

Thursday, November 2, 2017, 5:20 pm, Room 22

Session: Plasma Diagnostics, Sensors and Control
Presenter: Andrei Kolmakov, CNST/NIST
Authors: A. Tselev, University of Aveiro, Portugal
J. Fagan, NIST
A. Kolmakov, CNST/NIST
Correspondent: Click to Email

There exists a great need for in situ nanoscale characterization of surface/interface morphologies during plasma treatments. These include plasma induced growth, surface modification, sputtering and other processes relevant to semiconductor and aerospace industries, environmental remediation and biomedical applications. To address these needs, the current approaches rely on either “post mortem” sample microscopy or in situ optical analytical methods. The latter, however, lack required nanoscale spatial resolution.

In this communication, we propose to use near-field microwave imaging known as scanning Microwave Impedance Microscopy (sMIM) to image processes in plasma. Different to optical microscopy, the sMIM is sensitive to variations of local permittivity and conductivity of the material under a scanning probe. We demonstrate applicability of the sMIM to monitor plasma-assisted processes with a submicron spatial resolution. In our approach, a plasma environment with an object of interest is separated from the sMIM probe and the rest of the microscope by a SiN membrane of a few-10s nm thickness, and the imaging is performed through this membrane. As a proof of concept, we were able to image carbon nanotube films drop-casted onto the SiN membranes and their transformations in the process of plasma-induced oxidation by a low-pressure air plasma. To the best of our knowledge this is the first report on application of an SPM for in situ imaging of plasma processing. The experiential limitations such as electromechanical and thermal stability of the membranes will be discussed.