AVS 61st International Symposium & Exhibition
    Plasma Science and Technology Monday Sessions

Session PS-MoM
Current Challenges of Plasma Etching Technologies

Monday, November 10, 2014, 8:20 am, Room 308
Moderator: Saravanapriyan Sriraman, Lam Research Corp


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  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

8:20am PS-MoM1 Invited Paper
Dielectric Etch Challenges and Evolutions
Masanobu Honda, Tokyo Electron Miyagi Limited, Japan
9:00am PS-MoM3
Improving Selectivity for 10nm BEOL Etch Using C5HF7 Gas
Robert Bruce, IBM T.J. Watson Research Center, T. Suzuki, M. Nakamura, ZEON Chemicals L.P., A. Itou, G. Matsuura, Zeon Corporation, S.U. Engelmann, N.P. Marchack, E.M. Sikorski, IBM T.J. Watson Research Center, J. Lee, IBM Albany Nanotech Center, E.A. Joseph, IBM T.J. Watson Research Center
9:20am PS-MoM4
Effect of 147nm Photons on Porous Organo-Silicon Glass Materials and Damage Improvement by Optimized Cu/Low-k Integration Approaches
L. Zhang, IMEC, KU Leuven, Belgium, Jean-Francois de Marneffe, IMEC, Belgium, M. Lukaszewicz, Wroclaw University of Technology, Poland, S. Barry-Porter, F. Vajda, Trinity College Dublin, Ireland, Y. Sun, IMEC, Belgium, M.H. Heyne, IMEC, KU Leuven, Belgium, M. Baklanov, IMEC, Belgium
9:40am PS-MoM5
Non-PFC Plasma Chemistries for Patterning Low-k Dielectric Materials
Jack Kun-Chieh Chen, N. Altieri, M. Paine, T. Kim, J.P. Chang, UCLA
10:00am PS-MoM6
Optimization of the Optical Transmission of Submicron Silicon-on-Insulator Rib Waveguides
Marc Fouchier, E. Pargon, CNRS/UJF/CEA-LTM, France, B. Ben Bakir, P. Brianceau, J. Harduin, S. Barnola, P. Grosse, CEA-LETI, France
10:40am PS-MoM8
Using Post Etch Treatment (PET) to Resolve Poly Residue Defect Issue of Dummy Poly Removal (DPR) in hi-K Metal Gate Processing
Chih-Chien Wang, F.Y. Chang, C. Li-Chiang, S.-Y. Lu, United Microelectronics Co., Taiwan, Republic of China, P.-W. Huang, Y.-C. Kao, S.-Y. Cheng, T.-T. Su, Lam Research Corporation
11:00am PS-MoM9
Sidewall Roughness Characterization of an Advanced Spacer Patterning Process
Emmanuel Dupuy, M. Fouchier, E. Pargon, CNRS-LTM, France, J. Pradelles, CEA-Léti, France, H. Grampeix, CEA-LETI, France, P. Pimenta-Barros, S. Barnola, CEA, LETI, France, O. Joubert, LTM - CEA/LETI, France
11:20am PS-MoM10
Improving Pattern Fidelity for Selective Etch Processes
Nathan Marchack, S.U. Engelmann, E.A. Joseph, R.L. Bruce, H. Miyazoe, E.M. Sikorski, IBM T.J. Watson Research Center, T. Suzuki, M. Nakamura, ZEON Chemicals L.P., A. Itou, H. Matsumoto, Zeon Corporation