AVS 61st International Symposium & Exhibition
    Materials Characterization in the Semiconductor Industry Focus Topic Monday Sessions
       Session MC+AP+AS-MoM

Paper MC+AP+AS-MoM5
Quantitative 3-D Imaging of Filaments in Hybrid Resistive Memory Devices by Combined XPS and ToF-SIMS Spectroscopies

Monday, November 10, 2014, 9:40 am, Room 313

Session: Characterization of 3D Structures, 2D films and Interconnects
Presenter: Jean-Jacques Pireaux, University of Namur, Belgium
Authors: Y. Busby, University of Namur, Belgium
J.-J. Pireaux, University of Namur, Belgium
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Resistive switching has been observed in a multitude of inorganic (oxides, chalcogenides...) and hybrid (organic or polymers plus metal nanoparticles) thin films simply sandwiched between two metal electrodes. Organic memory devices are particularly promising candidates for developing large scale, high density, cost efficient, non-volatile resistive memories. Their switching mechanism has been for a long time suggested to depend on the formation/rupture of localized conducting paths (filaments). Using electrical characterization by impedance spectroscopy, filament formation has been experimentally demonstrated to be the dominant switching mechanism in many organic memories, only very recently (2014). Otherwise, despite of very dedicated efforts, few experimental techniques have so far succeeded in characterizing and providing information on filament(s).

The present work combines for the first time High Resolution X-Ray induced Photoelectron Spectroscopy (for its quantitative information capability) and Time-of-Flight Secondary Ion Mass Spectrometry (for its very high atomic sensitivity and 3D imaging capabilities) to quantitatively study both lateral and in depth elements distribution in a complete and operative organic memory device: what happens to be top electrode metal diffusion and filament formation is evidenced and quantitatively evaluated in memory devices which are based on a highly insulating and cross-linked polystyrene layer, processed by plasma polymerization, sandwiched between silver and indium tin oxide electrodes. Depth profiles evidence the metal diffusion in pristine and electrically addressed memory elements through the whole organic layer where the silver concentration can reach value as high as 5.1019 at/cm3. Filament formation is shown to be initiated during the top electrode evaporation, and is then successively enhanced by field induced diffusion during the electrical addressing. The 3-D ToF-SIMS images evidenced the formation of metallic paths extending through the entire device depth, electrically bridging the two electrodes when the element is in its low resistance state. Filaments with different characteristics have also been studied in organic memories based on a semiconducting polymer (Polyera N1400 ActiveInk) or on semiconducting small molecules (Tris-(8-hydroxyquinoline)aluminum, AlQ3). It appears therefore that metallic filaments are indeed at the origin of switching in organic memory devices.