AVS 61st International Symposium & Exhibition
    Materials Characterization in the Semiconductor Industry Focus Topic Monday Sessions
       Session MC+2D+AP+AS-MoA

Paper MC+2D+AP+AS-MoA2
Nitrogen Incorporation in Dilute Nitride III-V Semiconductors Measured by Resonant Nuclear Reaction Analysis and Ion Beam Channeling

Monday, November 10, 2014, 2:20 pm, Room 313

Session: Characterization of III-Vs (2:00-3:20 pm)/Photovoltaics, EUV masks, etc. (3:40-4:40 pm)
Presenter: John Demaree, US Army Research Laboratory
Authors: J. Demaree, US Army Research Laboratory
S.P. Svensson, US Army Research Laboratory
W.L. Sarney, US Army Research Laboratory
Correspondent: Click to Email

The behavior of dilute nitride III-V semiconductors depends critically on the number of nitrogen atoms residing substitutionally on Group V sites, and this small nitrogen incorporation may be used to tailor the optical bandgap for detection of electromagnetic radiation in future low-cost near-infrared imaging systems. In this study, films of GaAsN and GaSbN were synthesized using molecular beam epitaxy at various temperatures and growth rates, with the assistance of a nitrogen plasma source isotopically enriched with 15N. The films were examined using x-ray diffraction, secondary ion mass spectroscopy, x-ray photoelectron spectroscopy, and resonant nuclear reaction analysis (RNRA) to assess the amount of nitrogen incorporation. Furthermore, RNRA measurements were combined with ion beam channeling methods to ascertain the fraction of incorporated nitrogen atoms residing on substitutional and interstitial lattice sites. The narrow energy resonance and corresponding high depth resolution of the nuclear reaction used (the 897 keV p,gamma reaction with 15N) also enabled an assessment of the substitutional incorporation of the nitrogen throughout the thickness of the 100-400 nm thick films.