|AVS 58th Annual International Symposium and Exhibition|
|Applied Surface Science Division||Wednesday Sessions|
|Session:||Correlative Analysis - A Multi-technique Approach for Identification and Structure-Property Relationships|
|Presenter:||B.R. Rogers, Vanderbilt University|
|Authors:||B.R. Rogers, Vanderbilt University
R.R. Harl, Vanderbilt University
|Correspondent:||Click to Email|
Auger electron spectroscopy (AES) depth profiling has been used to characterize thin films for decades. Thin film depth profiling using x-ray photoelectron spectroscopy (XPS) has become increasingly common due to recent advances in XPS instrumentation. Often the choice of which depth -technique is best for a particular sample is not clear. In this presentation I will compare the logistics and results of AES and XPS depth profiling of insulating and metallic multicomponent thin films. Depth profiles of SiOxCy and CrSixNy thin films acquired using both techniques will be presented. Sample preparation, analysis set-up, and analysis time will be compared. Signal to noise and interface sharpness of the resulting profiles will be compared. The ability to determine chemical state information from the acquired data will also be discussed.