|AVS 55th International Symposium & Exhibition|
|Plasma Science and Technology||Tuesday Sessions|
Click a paper to see the details. Presenters are shown in bold type.
Examining Sidewall Formation, Passivation, and Etching in Nanometer-Scale Feature Fabrication using Molecular Dynamics Simulation
J.J. Végh, D.B. Graves, University of California, Berkeley
What are the Limiting Factors for Etching sub-10nm Si Holes?
Y. Zhang, E.M. Sikorski, B.N. To, IBM Research
|2:20pm||PS-TuA3 Invited Paper
Three Dimensional Modeling of Surface Profile Evolution During Plasma Etching (Plasma Prize Lecture)
H.H. Sawin, Massachusetts Institute of Technology
3-Dimensional Monte Carlo Simulation and Experimental Measurements of Surface Roughness under Plasma Etching
W. Guo, H. Kawai, H.H. Sawin, Massachusetts Institute of Technology
Scaling Relationships of Polymer Surface Roughening with Energy Density and Surface Composition during Plasma Processing
S. Engelmann, F. Weilnboeck, R.L. Bruce, G.S. Oehrlein, University of Maryland, College Park, C. Andes, Rohm and Haas Electronic Materials, D.B. Graves, D.G. Nest, University of California, Berkeley, E.A. Hudson, Lam Research
Plasma VUV-induced Degradation of Polymer Films: Effects of Radiation Wavelength
D.G. Nest, T.-Y. Chung, J.J. Vegh, D.B. Graves, University of California at Berkeley, S. Engelmann, F. Weilnboeck, R.L. Bruce, T.C. Lin, R. Phaneuf, G.S. Oehrlein, University of Maryland, College Park, B. Long, G. Willson, University of Texas, Austin, E.A. Hudson, Lam Research Corp., C. Andes, D. Wang, Rohm and Haas Electronic Materials
Plasma Radiation Effects on Photoresist Degradation and Depth Fluorination of Photoresists in Fluorocarbon Discharges
F. Weilnboeck, S. Engelmann, R.L. Bruce, G.S. Oehrlein, University of Maryland, D.G. Nest, D.B. Graves, University of California, Berkeley, C. Andes, D. Wang, Rohm and Haas Electronic Materials, E.A. Hudson, Lam Research Corp.
Ar Ion Sputtering of GaAs Studied by Molecular Dynamics Simulation and Laser Spectroscopy of Ga Atoms in the Gas Phase
E. Despiau-Pujo, P. Chabert, LPTP, CNRS - Ecole Polytechnique, France, R. Ramos, G. Cunge, N. Sadeghi, LTM, CNRS - UJF - INPG, France
Modeling of InP Etching under High Density Plasma of Cl2/Ar
B. Liu, A. Rhallabi, J.P. Landesman, Institut des Materiaux Jean Rouxel, France, J.L. Leclercq, Institut des Nanotechnologies de Lyon, France