| AVS 55th International Symposium & Exhibition | |
| Plasma Science and Technology | Thursday Sessions |
| Session PS2-ThM |
| Session: | Plasma Modeling |
| Presenter: | J. Hoang, University of California, Los Angeles |
| Authors: | J. Hoang, University of California, Los Angeles J.P. Chang, University of California, Los Angeles |
| Correspondent: | Click to Email |
In this work, a Monte Carlo based feature scale model was developed to accurately portray the profile evolution during shallow trench isolation etch (STIE) in chlorine based plasmas. A novel surface representation eliminates the artificial surface flux fluctuations due to the highly sloped sidewall features under simulation and the discrete cell nature of the simulation domain. It also enables a precise calculation of the surface normal, which dictates the trajectory of the reflected reactive species that control the profile evolution. The number of particles simulated is estimated from the depth and width of the etched profiles determined by scanning electron microscopy (SEM), with the assumption that the etch processes occur at high neutral-to-ion flux ratios. Through a set of carefully planned design of experiments (DOE) in which the effects of plasma density and plasma chemistry were assessed, the model was shown to accurately predict key features of STIE profiles, including microtrenching, mask faceting, and sidewall tapering, as a result of changing neutral-to-ion ratio, the mean ion energy, ion energy and/or angle distribution function. A two-dimensional numerical fluid model was developed to investigate the dual-coil and dual-feed reactor design on the radial profiles of plasma species, namely etch products and positive ions. The dual-coil parameter was determined to be effective in tailoring the radial ion flux profile at pressures higher than 20 mT, while the dual-feed parameter was shown to alter the etch product transport in the convection-dominant flow regime. Coupling of the reactor scale model to the feature scale model allowed investigation of subtle yet important changes in the etched feature profile from the center to the edge of the wafer. This hybrid model suggests that the radial decrease in the etch depth from wafer center to edge, seen from a set of DOE, is caused by an inherent net neutral-to-ion ratio decrease. In addition, the increase in the silicon sidewall angle from wafer center to edge can be qualitatively explained by a decrease in the concentration of the etch products. To study the local variations at the die/meso scale, the simulation domain is expanded to study the effects of etch product distributions at the die level.