|AVS 54th International Symposium|
|Plasma Science and Technology||Tuesday Sessions|
Click a paper to see the details. Presenters are shown in bold type.
Influence of Gas Heating on Microplasma I-V Characteristics
S.G. Belostotskiy, V.M. Donnelly, D.J. Economou, University of Houston
RF Discharge under the Influence of a Magnetic Field
E.V. Barnat, P.A. Miller, Sandia National Laboratories, A.M. Paterson, Applied Materials
Characterization of a High Power Surface Wave O2/N2 Plasma Jet for Removing Photoresist from Semiconductor Wafers
M. Bhargava, B. Craver, H. Guo, University of Houston, A.K. Srivastava, Axcelis Technologies, J.C. Wolfe, University of Houston
Effect of DC Superposition on the Selective Etching of SiO2 over Si3N4 in Dual Frequency Capacitively Coupled Plasma
S.-O. Lee, M.-S. Lee, S.-H. Cho, Y.-S. Cho, S.-C. Moon, J.-W. Kim, HYNIX Semiconductor Inc., Republic of Korea
Frequency and Pressure Effects in Plasma Etching of High Aspect Ratio Features in Dielectric Films
E.A. Hudson, C. Hayden, D.L. Keil, S. Engelmann, C. Rusu, L. Romm, M. Srinivasan, Lam Research Corp.
Numerical Investigation of Wave Effects in High-Frequency Capacitively Coupled Plasmas
Y. Yang, M.J. Kushner, Iowa State University
Physics of Very High Frequency (VHF) Capacitively Coupled Plasma Discharges
S. Rauf, K. Bera, K. Collins, Applied Materials, Inc.
|4:40pm||PS2-TuA10 Invited Paper
Electron Heating Mechanisms, Mode Transitions, and Non-Uniformities in Dual Frequency Capacitive Discharges
P. Chabert, École Polytechnique, France