| AVS 54th International Symposium | |
| Plasma Science and Technology | Tuesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 1:40pm | PS2-TuA1 Influence of Gas Heating on Microplasma I-V Characteristics S.G. Belostotskiy, V.M. Donnelly, D.J. Economou, University of Houston |
| 2:00pm | PS2-TuA2 RF Discharge under the Influence of a Magnetic Field E.V. Barnat, P.A. Miller, Sandia National Laboratories, A.M. Paterson, Applied Materials |
| 2:20pm | PS2-TuA3 Characterization of a High Power Surface Wave O2/N2 Plasma Jet for Removing Photoresist from Semiconductor Wafers M. Bhargava, B. Craver, H. Guo, University of Houston, A.K. Srivastava, Axcelis Technologies, J.C. Wolfe, University of Houston |
| 2:40pm | PS2-TuA4 Effect of DC Superposition on the Selective Etching of SiO2 over Si3N4 in Dual Frequency Capacitively Coupled Plasma S.-O. Lee, M.-S. Lee, S.-H. Cho, Y.-S. Cho, S.-C. Moon, J.-W. Kim, HYNIX Semiconductor Inc., Republic of Korea |
| 3:00pm | PS2-TuA5 Frequency and Pressure Effects in Plasma Etching of High Aspect Ratio Features in Dielectric Films E.A. Hudson, C. Hayden, D.L. Keil, S. Engelmann, C. Rusu, L. Romm, M. Srinivasan, Lam Research Corp. |
| 4:00pm | PS2-TuA8 Numerical Investigation of Wave Effects in High-Frequency Capacitively Coupled Plasmas Y. Yang, M.J. Kushner, Iowa State University |
| 4:20pm | PS2-TuA9 Physics of Very High Frequency (VHF) Capacitively Coupled Plasma Discharges S. Rauf, K. Bera, K. Collins, Applied Materials, Inc. |
| 4:40pm | PS2-TuA10 Invited Paper Electron Heating Mechanisms, Mode Transitions, and Non-Uniformities in Dual Frequency Capacitive Discharges P. Chabert, École Polytechnique, France |