| AVS 54th International Symposium | |
| Plasma Science and Technology | Wednesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 1:40pm | PS1-WeA1 Real-Time and Wafer-to-Wafer Control Strategies to Address Seasoning of Plasma Etching Reactors A. Agarwal, University of Illinois at Urbana-Champaign, M.J. Kushner, Iowa State University |
| 2:00pm | PS1-WeA2 Chamber Walls Coatings during Hard Mask Patterning of Ultra Low-k Materials: Consequences on Cleaning Strategies T. Chevolleau, LTM, France, M. Darnon, LTM-CNRS, France, T. David, N. Posseme, CEA-LETI-MINATEC, France, J. Torres, STM, France, O. Joubert, LTM-CNRS, France |
| 2:20pm | PS1-WeA3 How Electron Density and Collision Rate Reflect the Properties of Chamber Wall and Substrate in IC Manufacturing M. Klick, L. Eichhorn, Plasmetrex GmbH, Germany, R. Benson, D. Steckert, Micron Technologies, Inc. |
| 2:40pm | PS1-WeA4 Surface Reactions of Atomic and Molecular Chlorine on Anodized Aluminum Surface in Chlorine Plasmas J. Guha, V.M. Donnelly, University of Houston |
| 3:00pm | PS1-WeA5 Impact of Cu Contamination on Chamber Walls on Via-Hole CD Shift in Cu Dual Damascene Etching H. Hayashi, K. Sato, K. Yamamoto, T. Kaminatsui, A. Kojima, I. Sakai, M. Hasegawa, T. Ohiwa, Toshiba Corporation, Japan |
| 4:00pm | PS1-WeA8 Invited Paper Plasma-Wall Interactions in Inductively Coupled Plasma Reactor and a Novel Method for Wall Condition Control H. Singh, Lam Research Corporation |
| 4:40pm | PS1-WeA10 Recombination of Oxygen Atoms on Dynamic Stainless Steel Surfaces L. Stafford, J. Guha, V.M. Donnelly, University of Houston |
| 5:00pm | PS1-WeA11 The Effect of Wall Conditions on the Self-Limiting Deposition of Metal Oxides by Pulsed Plasma-Enhanced Chemical Vapor Deposition M.T. Seman, S.F. Szymanski, C.A. Wolden, Colorado School of Mines |